Chiplet Design and Heterogeneous Integration Packaging PDF Download

Author: John H. Lau
Publisher: Springer Nature
ISBN: 9811999171
Category : Technology & Engineering
Languages : en
Pages : 542

View

Book Description
The book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as chip partitioning, chip splitting, multiple system and heterogeneous integration with TSV-interposers, multiple system and heterogeneous integration with TSV-less interposers, chiplets lateral communication, system-in-package, fan-out wafer/panel-level packaging, and various Cu-Cu hybrid bonding. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.

Author: John H. Lau
Publisher: Springer Nature
ISBN: 9811613761
Category : Technology & Engineering
Languages : en
Pages : 513

View

Book Description
The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.

Author: John H. Lau
Publisher: Springer
ISBN: 9811372241
Category : Technology & Engineering
Languages : en
Pages : 368

View

Book Description
Heterogeneous integration uses packaging technology to integrate dissimilar chips, LED, MEMS, VCSEL, etc. from different fabless houses and with different functions and wafer sizes into a single system or subsystem. How are these dissimilar chips and optical components supposed to talk to each other? The answer is redistribution layers (RDLs). This book addresses the fabrication of RDLs for heterogeneous integrations, and especially focuses on RDLs on: A) organic substrates, B) silicon substrates (through-silicon via (TSV)-interposers), C) silicon substrates (bridges), D) fan-out substrates, and E) ASIC, memory, LED, MEMS, and VCSEL systems. The book offers a valuable asset for researchers, engineers, and graduate students in the fields of semiconductor packaging, materials sciences, mechanical engineering, electronic engineering, telecommunications, networking, etc.

Author: John H. Lau
Publisher: McGraw Hill Professional
ISBN: 007184807X
Category : Technology & Engineering
Languages : en
Pages : 512

View

Book Description
A comprehensive guide to 3D IC integration and packaging technology 3D IC Integration and Packaging fully explains the latest microelectronics techniques for increasing chip density and maximizing performance while reducing power consumption. Based on a course developed by its author, this practical guide offers real-world problem-solving methods and teaches the trade-offs inherent in making system-level decisions. Explore key enabling technologies such as TSV, thin-wafer strength measurement and handling, microsolder bumping, redistribution layers, interposers, wafer-to-wafer bonding, chip-to-wafer bonding, 3D IC and MEMS, LED, and complementary metal-oxide semiconductor image sensors integration. Assembly, thermal management, and reliability are covered in complete detail. 3D IC Integration and Packaging covers: • 3D integration for semiconductor IC packaging• Through-silicon vias modeling and testing• Stress sensors for thin-wafer handling and strength measurement• Package substrate technologies• Microbump fabrication, assembly, and reliability• 3D Si integration• 2.5D/3D IC integration• 3D IC integration with passive interposer• Thermal management of 2.5D/3D IC integration• Embedded 3D hybrid integration• 3D LED and IC integration• 3D MEMS and IC integration• 3D CMOS image sensors and IC integration• PoP, chip-to-chip interconnects, and embedded fan-out WLP

Author: Karli Verghese
Publisher: Springer Science & Business Media
ISBN: 0857299883
Category : Technology & Engineering
Languages : en
Pages : 384

View

Book Description
The packaging industry is under pressure from regulators, customers and other stakeholders to improve packaging’s sustainability by reducing its environmental and societal impacts. This is a considerable challenge because of the complex interactions between products and their packaging, and the many roles that packaging plays in the supply chain. Packaging for Sustainability is a concise and readable handbook for practitioners who are trying to implement sustainability strategies for packaging. Industry case studies are used throughout the book to illustrate possible applications and scenarios. Packaging for Sustainability draws on the expertise of researchers and industry practitioners to provide information on business benefits, environmental issues and priorities, environmental evaluation tools, design for environment, marketing strategies, and challenges for the future.

Author: John H. Lau
Publisher: Springer
ISBN: 9789819721399
Category : Technology & Engineering
Languages : en
Pages : 0

View

Book Description
This book focuses on the design, materials, process, fabrication, and reliability of flip chip, hybrid bonding, fan-in, and fan-out technology. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as wafer bumping, flip chip assembly, underfill and reliability, chip-to-wafer, wafer-to-wafer, Cu-Cu hybrid bonding, WLCSP, 6-side molded WLCSP, FOWLP such as hybrid substrates with PID, ABF, and ultra-large organic interposer, the communications between chiplets and heterogeneous integration packaging, and on-board optics, near-package optics, and co-packaged optics. The book benefits researchers, engineers, and graduate students in the fields of electrical engineering, mechanical engineering, materials sciences, industry engineering, etc.

Author: Apostolos Papanikolaou
Publisher: Springer
ISBN: 9401787514
Category : Technology & Engineering
Languages : en
Pages : 628

View

Book Description
This book deals with ship design and in particular with methodologies of the preliminary design of ships. The book is complemented by a basic bibliography and five appendices with useful updated charts for the selection of the main dimensions and other basic characteristics of different types of ships (Appendix A), the determination of hull form from the data of systematic hull form series (Appendix B), the detailed description of the relational method for the preliminary estimation of ship weights (Appendix C), a brief review of the historical evolution of shipbuilding science and technology from the prehistoric era to date (Appendix D) and finally a historical review of regulatory developments of ship's damage stability to date (Appendix E). The book can be used as textbook for ship design courses or as additional reading for university or college students of naval architecture courses and related disciplines; it may also serve as a reference book for naval architects, practicing engineers of related disciplines and ship officers, who like to enter the ship design field systematically or to use practical methodologies for the estimation of ship's main dimensions and of other ship main properties and elements of ship design.

Author: Salvatore Baglio
Publisher: John Wiley & Sons
ISBN: 9780470034088
Category : Technology & Engineering
Languages : en
Pages : 244

View

Book Description
This accessible volume delivers a complete design methodology for microelectromechanical systems (MEMS). Focusing on the scaling of an autonomous micro-system, it explains the real-world problems and theoretical concepts of several different aspects inherent to the miniaturization of sensors and actuators. It reports on the analysis of dimensional scaling, the modelling, design and experimental characterization of a wide range of specific devices and applications, including: temperature microsensors based on an integrated complementary metal-oxide-semiconductor (CMOS) thermocouple; mechanical sensors; inductive microsensors for the detection of magnetic particles; electrostatic, thermal and magnetic actuators. With an original approach, this informative text encompasses the entire range of themes currently at the forefront of MEMS, including an analysis of the importantissue of energy sources in MEMS. In addition, the book explores contemporary research into the design of complete MEMS with a case study on colonies of microbots. Scaling Issues and Design of MEMS aims to improve the reader’s basic knowledge on modelling issues of complex micro devices, and to encourage new thinking about scaling effects. It will provide support for practising engineers working within the defence industry and will also be of welcome interest to graduate students and researchers with a background in electronic engineering, physics, chemistry, biology and materials science.

Author: Yash Agrawal
Publisher: Springer Nature
ISBN: 9819944767
Category : Technology & Engineering
Languages : en
Pages : 286

View

Book Description
This contributed book provides a thorough understanding of the basics along with detailed state-of-the-art emerging interconnect technologies for integrated circuit design and flexible electronics. It focuses on the investigation of advanced on-chip interconnects which match the current as well as future technology requirements. The contents focus on different aspects of interconnects such as material, physical characteristics, parasitic extraction, design, structure, modeling, machine learning, and neural network-based models for interconnects, signaling schemes, varying signal integrity performance analysis, variability, reliability aspects, associated electronic design automation tools. The book also explores interconnect technologies for flexible electronic systems. It also highlights the integration of sensors with stretchable interconnects to demonstrate the concept of a stretchable sensing network for wearable and flexible applications. This book is a useful guide for those working in academia and industry to understand the fundamentals and application of interconnect technologies.

Author: Guo Qi Zhang
Publisher: Springer Science & Business Media
ISBN: 0387755934
Category : Technology & Engineering
Languages : en
Pages : 338

View

Book Description
In the past decades, the mainstream of microelectronics progression was mainly powered by Moore's law focusing on IC miniaturization down to nano scale. However, there is a fast increasing need for "More than Moore" (MtM) products and technology that are based upon or derived from silicon technologies, but do not simply scale with Moore’s law. This book provides new vision, strategy and guidance for the future technology and business development of micro/nanoelectronics.