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Author: Eric C. Guyer Publisher: CRC Press ISBN: 9781560328117 Category : Technology & Engineering Languages : en Pages : 710
Book Description
Gives a foundation to the four principle facets of thermal design: heat transfer analysis, materials performance, heating and cooling technology, and instrumentation and control. The focus is on providing practical thermal design and development guidance across the spectrum of problem analysis, material applications, equipment specification, and sensor and control selection.
Author: Eric C. Guyer Publisher: CRC Press ISBN: 9781560328117 Category : Technology & Engineering Languages : en Pages : 710
Book Description
Gives a foundation to the four principle facets of thermal design: heat transfer analysis, materials performance, heating and cooling technology, and instrumentation and control. The focus is on providing practical thermal design and development guidance across the spectrum of problem analysis, material applications, equipment specification, and sensor and control selection.
Author: Adrian Bejan Publisher: John Wiley & Sons ISBN: 9780471584674 Category : Technology & Engineering Languages : en Pages : 562
Book Description
A comprehensive and rigorous introduction to thermal system designfrom a contemporary perspective Thermal Design and Optimization offers readers a lucid introductionto the latest methodologies for the design of thermal systems andemphasizes engineering economics, system simulation, andoptimization methods. The methods of exergy analysis, entropygeneration minimization, and thermoeconomics are incorporated in anevolutionary manner. This book is one of the few sources available that addresses therecommendations of the Accreditation Board for Engineering andTechnology for new courses in design engineering. Intended forclassroom use as well as self-study, the text provides a review offundamental concepts, extensive reference lists, end-of-chapterproblem sets, helpful appendices, and a comprehensive case studythat is followed throughout the text. Contents include: * Introduction to Thermal System Design * Thermodynamics, Modeling, and Design Analysis * Exergy Analysis * Heat Transfer, Modeling, and Design Analysis * Applications with Heat and Fluid Flow * Applications with Thermodynamics and Heat and Fluid Flow * Economic Analysis * Thermoeconomic Analysis and Evaluation * Thermoeconomic Optimization Thermal Design and Optimization offers engineering students,practicing engineers, and technical managers a comprehensive andrigorous introduction to thermal system design and optimizationfrom a distinctly contemporary perspective. Unlike traditionalbooks that are largely oriented toward design analysis andcomponents, this forward-thinking book aligns itself with anincreasing number of active designers who believe that moreeffective, system-oriented design methods are needed. Thermal Design and Optimization offers a lucid presentation ofthermodynamics, heat transfer, and fluid mechanics as they areapplied to the design of thermal systems. This book broadens thescope of engineering design by placing a strong emphasis onengineering economics, system simulation, and optimizationtechniques. Opening with a concise review of fundamentals, itdevelops design methods within a framework of industrialapplications that gradually increase in complexity. Theseapplications include, among others, power generation by large andsmall systems, and cryogenic systems for the manufacturing,chemical, and food processing industries. This unique book draws on the best contemporary thinking aboutdesign and design methodology, including discussions of concurrentdesign and quality function deployment. Recent developments basedon the second law of thermodynamics are also included, especiallythe use of exergy analysis, entropy generation minimization, andthermoeconomics. To demonstrate the application of important designprinciples introduced, a single case study involving the design ofa cogeneration system is followed throughout the book. In addition, Thermal Design and Optimization is one of the best newsources available for meeting the recommendations of theAccreditation Board for Engineering and Technology for more designemphasis in engineering curricula. Supported by extensive reference lists, end-of-chapter problemsets, and helpful appendices, this is a superb text for both theclassroom and self-study, and for use in industrial design,development, and research. A detailed solutions manual is availablefrom the publisher.
Author: Ralph Remsburg Publisher: CRC Press ISBN: 1351835912 Category : Technology & Engineering Languages : en Pages : 400
Book Description
In a field where change and growth is inevitable, new electronic packaging problems continually arise. Smaller, more powerful devices are prone to overheating, causing intermittent system failures, corrupted signals, lower MTBF, and outright system failure. Since convection cooling is the heat transfer path most engineers take to deal with thermal problems, it is appropriate to gain as much understanding about the underlying mechanisms of fluid motion as possible. Thermal Design of Electronic Equipment is the only book that specifically targets the formulas used by electronic packaging and thermal engineers. It presents heat transfer equations dealing with polyalphaolephin (PAO), silicone oils, perfluorocarbons, and silicate ester-based liquids. Instead of relying on theoretical expressions and text explanations, the author presents empirical formulas and practical techniques that allow you to quickly solve nearly any thermal engineering problem in electronic packaging.
Author: F. A. Kulacki Publisher: ISBN: 9781787852310 Category : Electronic books Languages : en Pages :
Book Description
This Handbook provides researchers, faculty, design engineers in industrial R&D, and practicing engineers in the field concise treatments of advanced and more-recently established topics in thermal science and engineering, with an important emphasis on micro- and nanosystems, not covered in earlier references on applied thermal science, heat transfer or relevant aspects of mechanical/chemical engineering.
Author: Kuppan Thulukkanam Publisher: CRC Press ISBN: 1439842124 Category : Technology & Engineering Languages : en Pages : 1275
Book Description
Completely revised and updated to reflect current advances in heat exchanger technology, Heat Exchanger Design Handbook, Second Edition includes enhanced figures and thermal effectiveness charts, tables, new chapter, and additional topics––all while keeping the qualities that made the first edition a centerpiece of information for practicing engineers, research, engineers, academicians, designers, and manufacturers involved in heat exchange between two or more fluids. See What’s New in the Second Edition: Updated information on pressure vessel codes, manufacturer’s association standards A new chapter on heat exchanger installation, operation, and maintenance practices Classification chapter now includes coverage of scrapped surface-, graphite-, coil wound-, microscale-, and printed circuit heat exchangers Thorough revision of fabrication of shell and tube heat exchangers, heat transfer augmentation methods, fouling control concepts and inclusion of recent advances in PHEs New topics like EMbaffle®, Helixchanger®, and Twistedtube® heat exchanger, feedwater heater, steam surface condenser, rotary regenerators for HVAC applications, CAB brazing and cupro-braze radiators Without proper heat exchanger design, efficiency of cooling/heating system of plants and machineries, industrial processes and energy system can be compromised, and energy wasted. This thoroughly revised handbook offers comprehensive coverage of single-phase heat exchangers—selection, thermal design, mechanical design, corrosion and fouling, FIV, material selection and their fabrication issues, fabrication of heat exchangers, operation, and maintenance of heat exchangers —all in one volume.
Author: Eric Silk Publisher: Cambridge University Press ISBN: 1107193796 Category : Science Languages : en Pages : 587
Book Description
Develop a fundamental understanding of heat transfer analysis techniques as applied to earth based spacecraft with this practical guide. Written in a tutorial style, this essential text provides a how-to manual tailored for those who wish to understand and develop spacecraft thermal analyses. Providing an overview of basic heat transfer analysis fundamentals such as thermal circuits, limiting resistance, MLI, environmental thermal sources and sinks, as well as contemporary space based thermal technologies, and the distinctions between design considerations inherent to room temperature and cryogenic temperature applications, this is the perfect tool for graduate students, professionals and academic researchers.
Author: Ralph Remsburg Publisher: CRC Press ISBN: 142004236X Category : Technology & Engineering Languages : en Pages : 395
Book Description
In a field where change and growth is inevitable, new electronic packaging problems continually arise. Smaller, more powerful devices are prone to overheating, causing intermittent system failures, corrupted signals, lower MTBF, and outright system failure. Since convection cooling is the heat transfer path most engineers take to deal with thermal problems, it is appropriate to gain as much understanding about the underlying mechanisms of fluid motion as possible. Thermal Design of Electronic Equipment is the only book that specifically targets the formulas used by electronic packaging and thermal engineers. It presents heat transfer equations dealing with polyalphaolephin (PAO), silicone oils, perfluorocarbons, and silicate ester-based liquids. Instead of relying on theoretical expressions and text explanations, the author presents empirical formulas and practical techniques that allow you to quickly solve nearly any thermal engineering problem in electronic packaging.
Author: Kuppan Thulukkanam Publisher: CRC Press ISBN: 1439842132 Category : Science Languages : en Pages : 1245
Book Description
This comprehensive reference covers important aspects of heat exchangers (HEs): design and modes of operation and practical, large-scale applications in process, power, petroleum, transport, air conditioning, refrigeration, cryogenics, heat recovery, energy, and other industries. This second edition includes over 400 drawings, diagrams, tables, and equations, includes updated material throughout; coverage of the latest advances in HE design techniques; expanded and updated coverage of materials selection; and a look at the newest fabrication techniques.
Author: David A. Palmer Publisher: CRC Press ISBN: 1351079433 Category : Science Languages : en Pages : 284
Book Description
This practical handbook features an overview of the importance of physical properties and thermodynamics; and the use of thermo-dynamics to predict the extent of reaction in proposed new chem-ical combinations. The use of special types of data and pre-diction methods to develop flowsheets for probing projects; and sources of critically evaluated data, dividing the published works into three categories depending on quality are given. Methods of doing one's own critical evaluation of literature, a list of known North American contract experimentalists with the types of data mea-sured by each, methods for measuring equilibrium data, and ther-modynamic concepts to carry out process opti-mization are also featured.
Author: Ralph Remsburg Publisher: Springer Science & Business Media ISBN: 1441985093 Category : Technology & Engineering Languages : en Pages : 589
Book Description
The field of electronic packaging continues to grow at an amazing rate. To be successful in this field requires analytical skills, a foundation in mechanical engineering, and access to the latest developments in the electronics field. The emphasis for each project that the electronic packaging engineer faces changes from project to project, and from company to company, yet some constants should continue into the foreseeable future. One of these is the emphasis on ther mal design. Although just a few years ago thermal analysis of electronic equipment was an afterthought, it is becoming one of the primary aspects of many packaging jobs. It seems that the days of just adding a bigger fan to reduce the overheat ing problem are almost over. Replacing that thought is the up-front commitment to CFD (Computational Fluid Dynamics) software code, FEA (Finite Element Analysis) software, and the realization that the problem will only get worse. As the electronic circuit size is reduced, speed is increased. As the power of these systems increases and the volume allowed diminishes, heat flux or density (heat per unit area, W/m 2 or Btulh ft2) has spiraled. Much of the improvement in the reliability and packaging density of electronic circuits can be traced to advances in thermal design. While air cooling is still used extensively, advanced heat transfer techniques using exotic synthetic liquids are becoming more prominent, allowing still smaller systems to be manufactured. The appli cation of advanced thermal management techniques requires a background in fluid dynamics.
Author: Eric C. Guyer
Author: Eric C. Guyer
Author: Adrian Bejan
Author: Ralph Remsburg
Author: F. A. Kulacki
Author: Kuppan Thulukkanam
Author: Eric Silk
Author: Ralph Remsburg
Author: Kuppan Thulukkanam
Author: David A. Palmer
Author: Ralph Remsburg