Author: Roel Gronheid
Publisher: Woodhead Publishing
ISBN: 0081002610
Category : Technology & Engineering
Languages : en
Pages : 328
Book Description
The directed self-assembly (DSA) method of patterning for microelectronics uses polymer phase-separation to generate features of less than 20nm, with the positions of self-assembling materials externally guided into the desired pattern. Directed self-assembly of Block Co-polymers for Nano-manufacturing reviews the design, production, applications and future developments needed to facilitate the widescale adoption of this promising technology. Beginning with a solid overview of the physics and chemistry of block copolymer (BCP) materials, Part 1 covers the synthesis of new materials and new processing methods for DSA. Part 2 then goes on to outline the key modelling and characterization principles of DSA, reviewing templates and patterning using topographical and chemically modified surfaces, line edge roughness and dimensional control, x-ray scattering for characterization, and nanoscale driven assembly. Finally, Part 3 discusses application areas and related issues for DSA in nano-manufacturing, including for basic logic circuit design, the inverse DSA problem, design decomposition and the modelling and analysis of large scale, template self-assembly manufacturing techniques. Authoritative outlining of theoretical principles and modeling techniques to give a thorough introdution to the topic Discusses a broad range of practical applications for directed self-assembly in nano-manufacturing Highlights the importance of this technology to both the present and future of nano-manufacturing by exploring its potential use in a range of fields
Directed Self-assembly of Block Co-polymers for Nano-manufacturing
Author: Roel Gronheid
Publisher: Woodhead Publishing
ISBN: 0081002610
Category : Technology & Engineering
Languages : en
Pages : 328
Book Description
The directed self-assembly (DSA) method of patterning for microelectronics uses polymer phase-separation to generate features of less than 20nm, with the positions of self-assembling materials externally guided into the desired pattern. Directed self-assembly of Block Co-polymers for Nano-manufacturing reviews the design, production, applications and future developments needed to facilitate the widescale adoption of this promising technology. Beginning with a solid overview of the physics and chemistry of block copolymer (BCP) materials, Part 1 covers the synthesis of new materials and new processing methods for DSA. Part 2 then goes on to outline the key modelling and characterization principles of DSA, reviewing templates and patterning using topographical and chemically modified surfaces, line edge roughness and dimensional control, x-ray scattering for characterization, and nanoscale driven assembly. Finally, Part 3 discusses application areas and related issues for DSA in nano-manufacturing, including for basic logic circuit design, the inverse DSA problem, design decomposition and the modelling and analysis of large scale, template self-assembly manufacturing techniques. Authoritative outlining of theoretical principles and modeling techniques to give a thorough introdution to the topic Discusses a broad range of practical applications for directed self-assembly in nano-manufacturing Highlights the importance of this technology to both the present and future of nano-manufacturing by exploring its potential use in a range of fields
Publisher: Woodhead Publishing
ISBN: 0081002610
Category : Technology & Engineering
Languages : en
Pages : 328
Book Description
The directed self-assembly (DSA) method of patterning for microelectronics uses polymer phase-separation to generate features of less than 20nm, with the positions of self-assembling materials externally guided into the desired pattern. Directed self-assembly of Block Co-polymers for Nano-manufacturing reviews the design, production, applications and future developments needed to facilitate the widescale adoption of this promising technology. Beginning with a solid overview of the physics and chemistry of block copolymer (BCP) materials, Part 1 covers the synthesis of new materials and new processing methods for DSA. Part 2 then goes on to outline the key modelling and characterization principles of DSA, reviewing templates and patterning using topographical and chemically modified surfaces, line edge roughness and dimensional control, x-ray scattering for characterization, and nanoscale driven assembly. Finally, Part 3 discusses application areas and related issues for DSA in nano-manufacturing, including for basic logic circuit design, the inverse DSA problem, design decomposition and the modelling and analysis of large scale, template self-assembly manufacturing techniques. Authoritative outlining of theoretical principles and modeling techniques to give a thorough introdution to the topic Discusses a broad range of practical applications for directed self-assembly in nano-manufacturing Highlights the importance of this technology to both the present and future of nano-manufacturing by exploring its potential use in a range of fields
New and Future Developments in Catalysis
Author: David A. Boyd
Publisher: Elsevier Inc. Chapters
ISBN: 0128081627
Category : Science
Languages : en
Pages : 512
Book Description
Publisher: Elsevier Inc. Chapters
ISBN: 0128081627
Category : Science
Languages : en
Pages : 512
Book Description
Block Copolymers II
Author: Volker Abetz
Publisher: Springer Science & Business Media
ISBN: 9783540269021
Category : Technology & Engineering
Languages : en
Pages : 272
Book Description
. A.J. M ller, V. Balsamo, M.L. Arnal: Nucleation and Crystallization in Diblock and Triblock Copolymers.- 2 J.-F. Gohy: Block Copolymer Micelles.- 3 M.A. Hillmyer: Nanoporous Materials from Block Copolymer Precursors.- 4 M. Li, C. Coenjarts, C.K. Ober: Patternable Block Copolymers.-
Publisher: Springer Science & Business Media
ISBN: 9783540269021
Category : Technology & Engineering
Languages : en
Pages : 272
Book Description
. A.J. M ller, V. Balsamo, M.L. Arnal: Nucleation and Crystallization in Diblock and Triblock Copolymers.- 2 J.-F. Gohy: Block Copolymer Micelles.- 3 M.A. Hillmyer: Nanoporous Materials from Block Copolymer Precursors.- 4 M. Li, C. Coenjarts, C.K. Ober: Patternable Block Copolymers.-
Extending Moore's Law through Advanced Semiconductor Design and Processing Techniques
Author: Wynand Lambrechts
Publisher: CRC Press
ISBN: 1351248650
Category : Computers
Languages : en
Pages : 361
Book Description
This book provides a methodological understanding of the theoretical and technical limitations to the longevity of Moore’s law. The book presents research on factors that have significant impact on the future of Moore’s law and those factors believed to sustain the trend of the last five decades. Research findings show that boundaries of Moore’s law primarily include physical restrictions of scaling electronic components to levels beyond that of ordinary manufacturing principles and approaching the bounds of physics. The research presented in this book provides essential background and knowledge to grasp the following principles: Traditional and modern photolithography, the primary limiting factor of Moore’s law Innovations in semiconductor manufacturing that makes current generation CMOS processing possible Multi-disciplinary technologies that could drive Moore's law forward significantly Design principles for microelectronic circuits and components that take advantage of technology miniaturization The semiconductor industry economic market trends and technical driving factors The complexity and cost associated with technology scaling have compelled researchers in the disciplines of engineering and physics to optimize previous generation nodes to improve system-on-chip performance. This is especially relevant to participate in the increased attractiveness of the Internet of Things (IoT). This book additionally provides scholarly and practical examples of principles in microelectronic circuit design and layout to mitigate technology limits of previous generation nodes. Readers are encouraged to intellectually apply the knowledge derived from this book to further research and innovation in prolonging Moore’s law and associated principles.
Publisher: CRC Press
ISBN: 1351248650
Category : Computers
Languages : en
Pages : 361
Book Description
This book provides a methodological understanding of the theoretical and technical limitations to the longevity of Moore’s law. The book presents research on factors that have significant impact on the future of Moore’s law and those factors believed to sustain the trend of the last five decades. Research findings show that boundaries of Moore’s law primarily include physical restrictions of scaling electronic components to levels beyond that of ordinary manufacturing principles and approaching the bounds of physics. The research presented in this book provides essential background and knowledge to grasp the following principles: Traditional and modern photolithography, the primary limiting factor of Moore’s law Innovations in semiconductor manufacturing that makes current generation CMOS processing possible Multi-disciplinary technologies that could drive Moore's law forward significantly Design principles for microelectronic circuits and components that take advantage of technology miniaturization The semiconductor industry economic market trends and technical driving factors The complexity and cost associated with technology scaling have compelled researchers in the disciplines of engineering and physics to optimize previous generation nodes to improve system-on-chip performance. This is especially relevant to participate in the increased attractiveness of the Internet of Things (IoT). This book additionally provides scholarly and practical examples of principles in microelectronic circuit design and layout to mitigate technology limits of previous generation nodes. Readers are encouraged to intellectually apply the knowledge derived from this book to further research and innovation in prolonging Moore’s law and associated principles.
TMS 2015 144th Annual Meeting and Exhibition
Author: The Minerals, Metals & Materials Society (TMS)
Publisher: John Wiley & Sons
ISBN: 1119093481
Category : Technology & Engineering
Languages : en
Pages : 1584
Book Description
The TMS 2015 Annual Meeting Supplemental Proceedings is a collection of papers from the TMS 2015 Annual Meeting & Exhibition, held March 15-19 in Orlando, Florida, USA. The papers in this volume represent 33 symposia from the meeting. This volume, along with the other proceedings volumes published for the meeting, and archival journals, such as Metallurgical and Materials Transactions and Journal of Electronic Materials, represents the available written record of the 73 symposia held at TMS2015. This proceedings volume contains both edited and unedited papers; the unedited papers have not necessarily been reviewed by the symposium organizers and are presented "as is." The opinions and statements expressed within the papers are those of the individual authors only, and no confirmations or endorsements are intended or implied.
Publisher: John Wiley & Sons
ISBN: 1119093481
Category : Technology & Engineering
Languages : en
Pages : 1584
Book Description
The TMS 2015 Annual Meeting Supplemental Proceedings is a collection of papers from the TMS 2015 Annual Meeting & Exhibition, held March 15-19 in Orlando, Florida, USA. The papers in this volume represent 33 symposia from the meeting. This volume, along with the other proceedings volumes published for the meeting, and archival journals, such as Metallurgical and Materials Transactions and Journal of Electronic Materials, represents the available written record of the 73 symposia held at TMS2015. This proceedings volume contains both edited and unedited papers; the unedited papers have not necessarily been reviewed by the symposium organizers and are presented "as is." The opinions and statements expressed within the papers are those of the individual authors only, and no confirmations or endorsements are intended or implied.
Introduction to Microlithography
Author: L. F. Thompson
Publisher:
ISBN:
Category : Art
Languages : en
Pages : 568
Book Description
Reviews the theory, materials, and processes used in the lithographic process by which circuit elements are fabricated (it is these elements' decreasing size that has made possible the miniaturization of electronic devices). After a brief historical introduction, four major topics are discussed: the physics of the lithographic process, organic resist materials, resist processing, and plasma etching. The new edition reflects the many changes that have occurred since the 1983 publication of this tutorial/reference. Annotation copyright by Book News, Inc., Portland, OR
Publisher:
ISBN:
Category : Art
Languages : en
Pages : 568
Book Description
Reviews the theory, materials, and processes used in the lithographic process by which circuit elements are fabricated (it is these elements' decreasing size that has made possible the miniaturization of electronic devices). After a brief historical introduction, four major topics are discussed: the physics of the lithographic process, organic resist materials, resist processing, and plasma etching. The new edition reflects the many changes that have occurred since the 1983 publication of this tutorial/reference. Annotation copyright by Book News, Inc., Portland, OR
TMS 2015 144th Annual Meeting & Exhibition, Annual Meeting Supplemental Proceedings
Author: The Minerals, Metals & Materials Society (TMS)
Publisher: Springer
ISBN: 3319481274
Category : Technology & Engineering
Languages : en
Pages :
Book Description
Publisher: Springer
ISBN: 3319481274
Category : Technology & Engineering
Languages : en
Pages :
Book Description
Handbook of Porous Carbon Materials
Author: Andrews Nirmala Grace
Publisher: Springer Nature
ISBN: 9811971889
Category : Science
Languages : en
Pages : 1176
Book Description
This handbook summarizes the current advancements and growth in sustainable carbonaceous porous materials for fabrication and revival of energy devices, fuel cells, sensors technology, solar cell technology, stealth technology in addition to biomedical applications. It also covers the potential applications of carbon materials in various fields such as chemical, engineering, biomedical and environmental sciences. It also confers the prospective utilization of 2D and 3D hierarchical porous carbon in different interdisciplinary engineering applications. The book discusses major challenges faced in the development of cost-effective future energy storage strategies and provides effective solutions for improvement in the performance of carbon-based materials. Given the content, this handbook will be useful for students, researchers and professionals working in the area of material chemistry and allied fields.
Publisher: Springer Nature
ISBN: 9811971889
Category : Science
Languages : en
Pages : 1176
Book Description
This handbook summarizes the current advancements and growth in sustainable carbonaceous porous materials for fabrication and revival of energy devices, fuel cells, sensors technology, solar cell technology, stealth technology in addition to biomedical applications. It also covers the potential applications of carbon materials in various fields such as chemical, engineering, biomedical and environmental sciences. It also confers the prospective utilization of 2D and 3D hierarchical porous carbon in different interdisciplinary engineering applications. The book discusses major challenges faced in the development of cost-effective future energy storage strategies and provides effective solutions for improvement in the performance of carbon-based materials. Given the content, this handbook will be useful for students, researchers and professionals working in the area of material chemistry and allied fields.
Materials and Processes for Next Generation Lithography
Author:
Publisher: Elsevier
ISBN: 0081003587
Category : Technology & Engineering
Languages : en
Pages : 634
Book Description
As the requirements of the semiconductor industry have become more demanding in terms of resolution and speed it has been necessary to push photoresist materials far beyond the capabilities previously envisioned. Currently there is significant worldwide research effort in to so called Next Generation Lithography techniques such as EUV lithography and multibeam electron beam lithography. These developments in both the industrial and the academic lithography arenas have led to the proliferation of numerous novel approaches to resist chemistry and ingenious extensions of traditional photopolymers. Currently most texts in this area focus on either lithography with perhaps one or two chapters on resists, or on traditional resist materials with relatively little consideration of new approaches. This book therefore aims to bring together the worlds foremost resist development scientists from the various community to produce in one place a definitive description of the many approaches to lithography fabrication. Assembles up-to-date information from the world’s premier resist chemists and technique development lithographers on the properties and capabilities of the wide range of resist materials currently under investigation Includes information on processing and metrology techniques Brings together multiple approaches to litho pattern recording from academia and industry in one place
Publisher: Elsevier
ISBN: 0081003587
Category : Technology & Engineering
Languages : en
Pages : 634
Book Description
As the requirements of the semiconductor industry have become more demanding in terms of resolution and speed it has been necessary to push photoresist materials far beyond the capabilities previously envisioned. Currently there is significant worldwide research effort in to so called Next Generation Lithography techniques such as EUV lithography and multibeam electron beam lithography. These developments in both the industrial and the academic lithography arenas have led to the proliferation of numerous novel approaches to resist chemistry and ingenious extensions of traditional photopolymers. Currently most texts in this area focus on either lithography with perhaps one or two chapters on resists, or on traditional resist materials with relatively little consideration of new approaches. This book therefore aims to bring together the worlds foremost resist development scientists from the various community to produce in one place a definitive description of the many approaches to lithography fabrication. Assembles up-to-date information from the world’s premier resist chemists and technique development lithographers on the properties and capabilities of the wide range of resist materials currently under investigation Includes information on processing and metrology techniques Brings together multiple approaches to litho pattern recording from academia and industry in one place
Microlithography
Author: Bruce W. Smith
Publisher: CRC Press
ISBN: 1351643444
Category : Technology & Engineering
Languages : en
Pages : 770
Book Description
The completely revised Third Edition to the bestselling Microlithography: Science and Technology provides a balanced treatment of theoretical and operational considerations, from fundamental principles to advanced topics of nanoscale lithography. The book is divided into chapters covering all important aspects related to the imaging, materials, and processes that have been necessary to drive semiconductor lithography toward nanometer-scale generations. Renowned experts from the world’s leading academic and industrial organizations have provided in-depth coverage of the technologies involved in optical, deep-ultraviolet (DUV), immersion, multiple patterning, extreme ultraviolet (EUV), maskless, nanoimprint, and directed self-assembly lithography, together with comprehensive descriptions of the advanced materials and processes involved. New in the Third Edition In addition to the full revision of existing chapters, this new Third Edition features coverage of the technologies that have emerged over the past several years, including multiple patterning lithography, design for manufacturing, design process technology co-optimization, maskless lithography, and directed self-assembly. New advances in lithography modeling are covered as well as fully updated information detailing the new technologies, systems, materials, and processes for optical UV, DUV, immersion, and EUV lithography. The Third Edition of Microlithography: Science and Technology authoritatively covers the science and engineering involved in the latest generations of microlithography and looks ahead to the future systems and technologies that will bring the next generations to fruition. Loaded with illustrations, equations, tables, and time-saving references to the most current technology, this book is the most comprehensive and reliable source for anyone, from student to seasoned professional, looking to better understand the complex world of microlithography science and technology.
Publisher: CRC Press
ISBN: 1351643444
Category : Technology & Engineering
Languages : en
Pages : 770
Book Description
The completely revised Third Edition to the bestselling Microlithography: Science and Technology provides a balanced treatment of theoretical and operational considerations, from fundamental principles to advanced topics of nanoscale lithography. The book is divided into chapters covering all important aspects related to the imaging, materials, and processes that have been necessary to drive semiconductor lithography toward nanometer-scale generations. Renowned experts from the world’s leading academic and industrial organizations have provided in-depth coverage of the technologies involved in optical, deep-ultraviolet (DUV), immersion, multiple patterning, extreme ultraviolet (EUV), maskless, nanoimprint, and directed self-assembly lithography, together with comprehensive descriptions of the advanced materials and processes involved. New in the Third Edition In addition to the full revision of existing chapters, this new Third Edition features coverage of the technologies that have emerged over the past several years, including multiple patterning lithography, design for manufacturing, design process technology co-optimization, maskless lithography, and directed self-assembly. New advances in lithography modeling are covered as well as fully updated information detailing the new technologies, systems, materials, and processes for optical UV, DUV, immersion, and EUV lithography. The Third Edition of Microlithography: Science and Technology authoritatively covers the science and engineering involved in the latest generations of microlithography and looks ahead to the future systems and technologies that will bring the next generations to fruition. Loaded with illustrations, equations, tables, and time-saving references to the most current technology, this book is the most comprehensive and reliable source for anyone, from student to seasoned professional, looking to better understand the complex world of microlithography science and technology.