Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces PDF Download

Author: Beth Keser
Publisher: John Wiley & Sons
ISBN: 1119793777
Category : Technology & Engineering
Languages : en
Pages : 324

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Book Description
Discover an up-to-date exploration of Embedded and Fan-Out Waver and Panel Level technologies In Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System-in-Package, a team of accomplished semiconductor experts delivers an in-depth treatment of various fan-out and embedded die approaches. The book begins with a market analysis of the latest technology trends in Fan-Out and Wafer Level Packaging before moving on to a cost analysis of these solutions. The contributors discuss the new package types for advanced application spaces being created by companies like TSMC, Deca Technologies, and ASE Group. Finally, emerging technologies from academia are explored. Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces is an indispensable resource for microelectronic package engineers, managers, and decision makers working with OEMs and IDMs. It is also a must-read for professors and graduate students working in microelectronics packaging research.

Author: Beth Keser
Publisher: John Wiley & Sons
ISBN: 1119314135
Category : Technology & Engineering
Languages : en
Pages : 576

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Book Description
Examines the advantages of Embedded and FO-WLP technologies, potential application spaces, package structures available in the industry, process flows, and material challenges Embedded and fan-out wafer level packaging (FO-WLP) technologies have been developed across the industry over the past 15 years and have been in high volume manufacturing for nearly a decade. This book covers the advances that have been made in this new packaging technology and discusses the many benefits it provides to the electronic packaging industry and supply chain. It provides a compact overview of the major types of technologies offered in this field, on what is available, how it is processed, what is driving its development, and the pros and cons. Filled with contributions from some of the field's leading experts,Advances in Embedded and Fan-Out Wafer Level Packaging Technologies begins with a look at the history of the technology. It then goes on to examine the biggest technology and marketing trends. Other sections are dedicated to chip-first FO-WLP, chip-last FO-WLP, embedded die packaging, materials challenges, equipment challenges, and resulting technology fusions. Discusses specific company standards and their development results Content relates to practice as well as to contemporary and future challenges in electronics system integration and packaging Advances in Embedded and Fan-Out Wafer Level Packaging Technologies will appeal to microelectronic packaging engineers, managers, and decision makers working in OEMs, IDMs, IFMs, OSATs, silicon foundries, materials suppliers, equipment suppliers, and CAD tool suppliers. It is also an excellent book for professors and graduate students working in microelectronic packaging research.

Author: John H. Lau
Publisher: Springer
ISBN: 9811088845
Category : Technology & Engineering
Languages : en
Pages : 303

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Book Description
This comprehensive guide to fan-out wafer-level packaging (FOWLP) technology compares FOWLP with flip chip and fan-in wafer-level packaging. It presents the current knowledge on these key enabling technologies for FOWLP, and discusses several packaging technologies for future trends. The Taiwan Semiconductor Manufacturing Company (TSMC) employed their InFO (integrated fan-out) technology in A10, the application processor for Apple’s iPhone, in 2016, generating great excitement about FOWLP technology throughout the semiconductor packaging community. For many practicing engineers and managers, as well as scientists and researchers, essential details of FOWLP – such as the temporary bonding and de-bonding of the carrier on a reconstituted wafer/panel, epoxy molding compound (EMC) dispensing, compression molding, Cu revealing, RDL fabrication, solder ball mounting, etc. – are not well understood. Intended to help readers learn the basics of problem-solving methods and understand the trade-offs inherent in making system-level decisions quickly, this book serves as a valuable reference guide for all those faced with the challenging problems created by the ever-increasing interest in FOWLP, helps to remove roadblocks, and accelerates the design, materials, process, and manufacturing development of key enabling technologies for FOWLP.

Author: John H. Lau
Publisher: Springer Nature
ISBN: 9811613761
Category : Technology & Engineering
Languages : en
Pages : 513

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Book Description
The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.

Author: Daniel Lu
Publisher: Springer
ISBN: 3319450980
Category : Technology & Engineering
Languages : en
Pages : 969

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Book Description
Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.

Author: Shichun Qu
Publisher: Springer
ISBN: 1493915568
Category : Technology & Engineering
Languages : en
Pages : 322

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Book Description
Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling. Recent advances in analog and power electronic WLCSP packaging are presented based on the development of analog technology and power device integration. The book covers in detail how advances in semiconductor content, analog and power advanced WLCSP design, assembly, materials and reliability have co-enabled significant advances in fan-in and fan-out with redistributed layer (RDL) of analog and power device capability during recent years. Since the analog and power electronic wafer level packaging is different from regular digital and memory IC package, this book will systematically introduce the typical analog and power electronic wafer level packaging design, assembly process, materials, reliability and failure analysis, and material selection. Along with new analog and power WLCSP development, the role of modeling is a key to assure successful package design. An overview of the analog and power WLCSP modeling and typical thermal, electrical and stress modeling methodologies is also presented in the book.

Author: William Greig
Publisher: Springer Science & Business Media
ISBN: 0387339132
Category : Technology & Engineering
Languages : en
Pages : 312

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Book Description
Reviewing the various IC packaging, assembly, and interconnection technologies, this professional reference provides an overview of the materials and the processes, as well as the trends and available options that encompass electronic manufacturing. It covers both the technical issues and touches on some of the reliability concerns with the various technologies applicable to packaging and assembly of the IC. The book discusses the various packaging approaches, assembly options, and essential manufacturing technologies, among other relevant topics.

Author: John H. Lau
Publisher: Springer
ISBN: 9811372241
Category : Technology & Engineering
Languages : en
Pages : 368

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Book Description
Heterogeneous integration uses packaging technology to integrate dissimilar chips, LED, MEMS, VCSEL, etc. from different fabless houses and with different functions and wafer sizes into a single system or subsystem. How are these dissimilar chips and optical components supposed to talk to each other? The answer is redistribution layers (RDLs). This book addresses the fabrication of RDLs for heterogeneous integrations, and especially focuses on RDLs on: A) organic substrates, B) silicon substrates (through-silicon via (TSV)-interposers), C) silicon substrates (bridges), D) fan-out substrates, and E) ASIC, memory, LED, MEMS, and VCSEL systems. The book offers a valuable asset for researchers, engineers, and graduate students in the fields of semiconductor packaging, materials sciences, mechanical engineering, electronic engineering, telecommunications, networking, etc.

Author: Peter Marwedel
Publisher: Springer Science & Business Media
ISBN: 9400702574
Category : Technology & Engineering
Languages : en
Pages : 400

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Book Description
Until the late 1980s, information processing was associated with large mainframe computers and huge tape drives. During the 1990s, this trend shifted toward information processing with personal computers, or PCs. The trend toward miniaturization continues and in the future the majority of information processing systems will be small mobile computers, many of which will be embedded into larger products and interfaced to the physical environment. Hence, these kinds of systems are called embedded systems. Embedded systems together with their physical environment are called cyber-physical systems. Examples include systems such as transportation and fabrication equipment. It is expected that the total market volume of embedded systems will be significantly larger than that of traditional information processing systems such as PCs and mainframes. Embedded systems share a number of common characteristics. For example, they must be dependable, efficient, meet real-time constraints and require customized user interfaces (instead of generic keyboard and mouse interfaces). Therefore, it makes sense to consider common principles of embedded system design. Embedded System Design starts with an introduction into the area and a survey of specification models and languages for embedded and cyber-physical systems. It provides a brief overview of hardware devices used for such systems and presents the essentials of system software for embedded systems, like real-time operating systems. The book also discusses evaluation and validation techniques for embedded systems. Furthermore, the book presents an overview of techniques for mapping applications to execution platforms. Due to the importance of resource efficiency, the book also contains a selected set of optimization techniques for embedded systems, including special compilation techniques. The book closes with a brief survey on testing. Embedded System Design can be used as a text book for courses on embedded systems and as a source which provides pointers to relevant material in the area for PhD students and teachers. It assumes a basic knowledge of information processing hardware and software. Courseware related to this book is available at http://ls12-www.cs.tu-dortmund.de/~marwedel.

Author: Scott Vetter
Publisher: IBM Redbooks
ISBN: 073845379X
Category : Computers
Languages : en
Pages : 86

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Book Description
This IBM® RedpaperTM publication describes the adapter-based virtualization capabilities that are being deployed in high-end IBM POWER7+TM processor-based servers. Peripheral Component Interconnect Express (PCIe) single root I/O virtualization (SR-IOV) is a virtualization technology on IBM Power Systems servers. SR-IOV allows multiple logical partitions (LPARs) to share a PCIe adapter with little or no run time involvement of a hypervisor or other virtualization intermediary. SR-IOV does not replace the existing virtualization capabilities that are offered as part of the IBM PowerVM® offerings. Rather, SR-IOV compliments them with additional capabilities. This paper describes many aspects of the SR-IOV technology, including: A comparison of SR-IOV with standard virtualization technology Overall benefits of SR-IOV Architectural overview of SR-IOV Planning requirements SR-IOV deployment models that use standard I/O virtualization Configuring the adapter for dedicated or shared modes Tips for maintaining and troubleshooting your system Scenarios for configuring your system This paper is directed to clients, IBM Business Partners, and system administrators who are involved with planning, deploying, configuring, and maintaining key virtualization technologies.