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Author: Sheldon Tan Publisher: Springer Nature ISBN: 3030261727 Category : Technology & Engineering Languages : en Pages : 460
Book Description
This book provides readers with a detailed reference regarding two of the most important long-term reliability and aging effects on nanometer integrated systems, electromigrations (EM) for interconnect and biased temperature instability (BTI) for CMOS devices. The authors discuss in detail recent developments in the modeling, analysis and optimization of the reliability effects from EM and BTI induced failures at the circuit, architecture and system levels of abstraction. Readers will benefit from a focus on topics such as recently developed, physics-based EM modeling, EM modeling for multi-segment wires, new EM-aware power grid analysis, and system level EM-induced reliability optimization and management techniques. Reviews classic Electromigration (EM) models, as well as existing EM failure models and discusses the limitations of those models; Introduces a dynamic EM model to address transient stress evolution, in which wires are stressed under time-varying current flows, and the EM recovery effects. Also includes new, parameterized equivalent DC current based EM models to address the recovery and transient effects; Presents a cross-layer approach to transistor aging modeling, analysis and mitigation, spanning multiple abstraction levels; Equips readers for EM-induced dynamic reliability management and energy or lifetime optimization techniques, for many-core dark silicon microprocessors, embedded systems, lower power many-core processors and datacenters.
Author: Sheldon Tan Publisher: Springer Nature ISBN: 3030261727 Category : Technology & Engineering Languages : en Pages : 460
Book Description
This book provides readers with a detailed reference regarding two of the most important long-term reliability and aging effects on nanometer integrated systems, electromigrations (EM) for interconnect and biased temperature instability (BTI) for CMOS devices. The authors discuss in detail recent developments in the modeling, analysis and optimization of the reliability effects from EM and BTI induced failures at the circuit, architecture and system levels of abstraction. Readers will benefit from a focus on topics such as recently developed, physics-based EM modeling, EM modeling for multi-segment wires, new EM-aware power grid analysis, and system level EM-induced reliability optimization and management techniques. Reviews classic Electromigration (EM) models, as well as existing EM failure models and discusses the limitations of those models; Introduces a dynamic EM model to address transient stress evolution, in which wires are stressed under time-varying current flows, and the EM recovery effects. Also includes new, parameterized equivalent DC current based EM models to address the recovery and transient effects; Presents a cross-layer approach to transistor aging modeling, analysis and mitigation, spanning multiple abstraction levels; Equips readers for EM-induced dynamic reliability management and energy or lifetime optimization techniques, for many-core dark silicon microprocessors, embedded systems, lower power many-core processors and datacenters.
Author: Ricardo Reis Publisher: Springer ISBN: 1461440785 Category : Technology & Engineering Languages : en Pages : 272
Book Description
This book presents physical understanding, modeling and simulation, on-chip characterization, layout solutions, and design techniques that are effective to enhance the reliability of various circuit units. The authors provide readers with techniques for state of the art and future technologies, ranging from technology modeling, fault detection and analysis, circuit hardening, and reliability management.
Author: Laung-Terng Wang Publisher: Morgan Kaufmann ISBN: 9780080556802 Category : Technology & Engineering Languages : en Pages : 896
Book Description
Modern electronics testing has a legacy of more than 40 years. The introduction of new technologies, especially nanometer technologies with 90nm or smaller geometry, has allowed the semiconductor industry to keep pace with the increased performance-capacity demands from consumers. As a result, semiconductor test costs have been growing steadily and typically amount to 40% of today's overall product cost. This book is a comprehensive guide to new VLSI Testing and Design-for-Testability techniques that will allow students, researchers, DFT practitioners, and VLSI designers to master quickly System-on-Chip Test architectures, for test debug and diagnosis of digital, memory, and analog/mixed-signal designs. Emphasizes VLSI Test principles and Design for Testability architectures, with numerous illustrations/examples. Most up-to-date coverage available, including Fault Tolerance, Low-Power Testing, Defect and Error Tolerance, Network-on-Chip (NOC) Testing, Software-Based Self-Testing, FPGA Testing, MEMS Testing, and System-In-Package (SIP) Testing, which are not yet available in any testing book. Covers the entire spectrum of VLSI testing and DFT architectures, from digital and analog, to memory circuits, and fault diagnosis and self-repair from digital to memory circuits. Discusses future nanotechnology test trends and challenges facing the nanometer design era; promising nanotechnology test techniques, including Quantum-Dots, Cellular Automata, Carbon-Nanotubes, and Hybrid Semiconductor/Nanowire/Molecular Computing. Practical problems at the end of each chapter for students.
Author: Alfons Schuster Publisher: Springer Science & Business Media ISBN: 1848002610 Category : Computers Languages : en Pages : 297
Book Description
Our time recognizes robustness as an important, all-pervading feature in the world around us. Despite its omnipresence, robustness is not entirely understood, rather dif?cult to de?ne, and, despite its obvious value in many situations, rather dif?cult to achieve. One of the goals of this edited book is to report on the topic of robustness from a variety and diverse range of ?elds and perspectives. We are interested, for instance, in fundamental strategies nature applies to make systems robust—and arguably “intelligent”—and how these strategies may hold as general design principles in modern technology. A particular focus is on computer-based systems and appli- tions. This in mind, the book has four main sections: Part I has a look at robustness in terms of underlying technologies and infrastr- tures upon which many computer-based “intelligent” systems reside and inves- gates robustness on the hardware and software level, but also in larger environments such as the Internet and self-managing systems. The contributions in Part II target robustness in research areas that are inspired by biology, including brain-computer interfaces, biological networks, and biological immune systems, for example. Part III involves the exciting ?eld of arti?cial intelligence. The chapters here discuss the value of robustness as a general design principle for arti?cial intelligence, stressing its potential in areas such as humanoid robotics and image processing.
Author: Bharat Bhushan Publisher: Springer Science & Business Media ISBN: 3540012184 Category : Technology & Engineering Languages : en Pages : 1232
Book Description
This major work has established itself as the definitive reference in the nanoscience and nanotechnology area in one volume. In presents nanostructures, micro/nanofabrication, and micro/nanodevices. Special emphasis is on scanning probe microscopy, nanotribology and nanomechanics, molecularly thick films, industrial applications and microdevice reliability, and on social aspects. Reflecting further developments, the new edition has grown from six to eight parts. The latest information is added to fields such as bionanotechnology, nanorobotics, and NEMS/MEMS reliability. This classic reference book is orchestrated by a highly experienced editor and written by a team of distinguished experts for those learning about the field of nanotechnology.
Author: J. Bhasker Publisher: Springer Science & Business Media ISBN: 0387938206 Category : Technology & Engineering Languages : en Pages : 588
Book Description
iming, timing, timing! That is the main concern of a digital designer charged with designing a semiconductor chip. What is it, how is it T described, and how does one verify it? The design team of a large digital design may spend months architecting and iterating the design to achieve the required timing target. Besides functional verification, the t- ing closure is the major milestone which dictates when a chip can be - leased to the semiconductor foundry for fabrication. This book addresses the timing verification using static timing analysis for nanometer designs. The book has originated from many years of our working in the area of timing verification for complex nanometer designs. We have come across many design engineers trying to learn the background and various aspects of static timing analysis. Unfortunately, there is no book currently ava- able that can be used by a working engineer to get acquainted with the - tails of static timing analysis. The chip designers lack a central reference for information on timing, that covers the basics to the advanced timing veri- cation procedures and techniques.
Author: Publisher: ISBN: Category : Aeronautics Languages : en Pages : 804
Book Description
Lists citations with abstracts for aerospace related reports obtained from world wide sources and announces documents that have recently been entered into the NASA Scientific and Technical Information Database.
Author: Afreen Khursheed Publisher: CRC Press ISBN: 1000504298 Category : Technology & Engineering Languages : en Pages : 239
Book Description
This textbook comprehensively covers on-chip interconnect dimension and application of carbon nanomaterials for modeling VLSI interconnect and buffer circuits. It provides analysis of ultra-low power high speed nano-interconnects based on different facets such as material modeling, circuit modeling and the adoption of repeater insertion strategies and measurement techniques. It covers important topics including on-chip interconnects, interconnect modeling, electrical impedance modeling of on-chip interconnects, modeling of repeater buffer and variability analysis. Pedagogical features including solved problems and unsolved exercises are interspersed throughout the text for better understanding. Aimed at senior undergraduate and graduate students in the field of electrical engineering, electronics and communications engineering for courses on Advanced VLSI Interconnects/Advanced VLSI Design/VLSI Interconnects/VLSI Design Automation and Techniques, this book: Provides comprehensive coverage of fundamental concepts related to nanotube transistors and interconnects. Discusses properties and performance of practical nanotube devices and related applications. Covers physical and electrical phenomena of carbon nanotubes, as well as applications enabled by this nanotechnology. Discusses the structure, properties, and characteristics of graphene-based on-chip interconnect. Examines interconnect power and interconnect delay issues arising due to downscaling of device size.
Author: Jens Lienig Publisher: Springer ISBN: 3319735586 Category : Technology & Engineering Languages : en Pages : 159
Book Description
The book provides a comprehensive overview of electromigration and its effects on the reliability of electronic circuits. It introduces the physical process of electromigration, which gives the reader the requisite understanding and knowledge for adopting appropriate counter measures. A comprehensive set of options is presented for modifying the present IC design methodology to prevent electromigration. Finally, the authors show how specific effects can be exploited in present and future technologies to reduce electromigration’s negative impact on circuit reliability.
Author: Sheldon Tan
Author: Sheldon Tan
Author: Ricardo Reis
Author: Laung-Terng Wang
Author: Hang Li
Author: Alfons Schuster
Author: Bharat Bhushan
Author: J. Bhasker
Author: 
Author: Afreen Khursheed
Author: Jens Lienig