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Author: Douglas Brooks Publisher: Artech House ISBN: 1630818615 Category : Technology & Engineering Languages : en Pages : 246
Book Description
A very important part of printed circuit board (PCB) design involves sizing traces and vias to carry the required current. This exciting new book will explore how hot traces and vias should be and what board, circuit, design, and environmental parameters are the most important. PCB materials (copper and dielectrics) and the role they play in the heating and cooling of traces are covered. The IPC curves found in IPC 2152, the equations that fit those curves and computer simulations that fit those curves and equations are detailed. Sensitivity analyses that show what happens when environments are varied, including adjacent traces and planes, changing trace lengths, and thermal gradients are presented. Via temperatures and what determines them are explored, along with fusing issues and what happens when traces are overloaded. Voltage drops across traces and vias, the thermal effects going around right-angle corners, and frequency effects are covered. Readers learn how to measure the thermal conductivity of dielectrics and how to measure the resistivity of copper traces and why many prior attempts to do so have been doomed to failure. Industrial CT Scanning, and whether or not they might replace microsections for measuring trace parameters are also considered.
Author: Douglas Brooks Publisher: Artech House ISBN: 1630818615 Category : Technology & Engineering Languages : en Pages : 246
Book Description
A very important part of printed circuit board (PCB) design involves sizing traces and vias to carry the required current. This exciting new book will explore how hot traces and vias should be and what board, circuit, design, and environmental parameters are the most important. PCB materials (copper and dielectrics) and the role they play in the heating and cooling of traces are covered. The IPC curves found in IPC 2152, the equations that fit those curves and computer simulations that fit those curves and equations are detailed. Sensitivity analyses that show what happens when environments are varied, including adjacent traces and planes, changing trace lengths, and thermal gradients are presented. Via temperatures and what determines them are explored, along with fusing issues and what happens when traces are overloaded. Voltage drops across traces and vias, the thermal effects going around right-angle corners, and frequency effects are covered. Readers learn how to measure the thermal conductivity of dielectrics and how to measure the resistivity of copper traces and why many prior attempts to do so have been doomed to failure. Industrial CT Scanning, and whether or not they might replace microsections for measuring trace parameters are also considered.
Author: Douglas Brooks Publisher: Createspace Independent Publishing Platform ISBN: 9781530389438 Category : Languages : en Pages : 202
Book Description
Finally! For the first time, here is a complete, thorough analysis of the relationships between PCB trace (and via) currents and trace temperatures. All in one place! Brooks has been looking at these relationships since the mid '90s. And he has assembled 20-plus years of knowledge into these pages. Starting with a historical background, this book covers: (a) PCB materials (copper and dielectrics) and the role they play in the heating and cooling of traces; (b) The IPC curves found in IPC 2152; (c) Equations that fit those curves; (d) Computer simulations that fit those curves and equations; (e) Sensitivity analyses showing what happens when we vary the environment (adjacent traces and planes, changing trace lengths, thermal gradients, etc.); (f) Via temperatures and what determines them; (g) Via current densities; (h) Fusing issues, what happens when traces are overloaded, and (g) a chapter showing how unevenly traces heat, even at low temperatures. There are supplemental chapters or appendices on measuring the thermal conductivity of dielectrics and measuring the resistivity of copper traces (and why many prior attempts have been doomed to failure.) And there is even a chapter on whether Industrial CT Scanning might replace microsections for measuring trace parameters. Never before has such a thorough compendium been available, especially so conveniently.
Author: Douglas Brooks Publisher: Pearson Education ISBN: 0133415333 Category : Technology & Engineering Languages : en Pages : 342
Book Description
Building on his widely praised seminars, Brooks explains what current is, how it flows, and how it reacts. He begins by reviewing the nature of current, and then explains current flow in basic circuits, discusses sources that supply and drive current, and addresses the unique problems associated with current on PCBs.
Author: Douglas G Brooks Phd Publisher: ISBN: 9781541213524 Category : Languages : en Pages :
Book Description
Brooks has been looking at these relationships since the mid '90s. And he has assembled 20-plus years of knowledge into these pages. Starting with a historical background, this book covers: (a) PCB materials (copper and dielectrics) and the role they play in the heating and cooling of traces; (b) The IPC curves found in IPC 2152; (c) Equations that fit those curves; (d) Computer simulations that fit those curves and equations; (e) Sensitivity analyses showing what happens when we vary the environment (adjacent traces and planes, changing trace lengths, thermal gradients, etc.); (f) Via temperatures and what determines them; (g) Via current densities; and (h) Fusing issues, what happens when traces are overloaded. There are supplemental chapters or appendices on measuring the thermal conductivity of dielectrics and measuring the resistivity of copper traces (and why many prior attempts to do so have been doomed to failure.) And there is even a chapter on whether Industrial CT Scanning might replace microsections for measuring trace parameters. This Second Edition adds two new chapters (on AC currents and on thermal gradients around right-angle corners), a greatly expanded Chapter 6 (Thermal Simulations), and other additional information throughout the text.
Author: Ron Mancini Publisher: Newnes ISBN: 0750677015 Category : Technology & Engineering Languages : en Pages : 470
Book Description
The operational amplifier ("op amp") is the most versatile and widely used type of analog IC, used in audio and voltage amplifiers, signal conditioners, signal converters, oscillators, and analog computing systems. Almost every electronic device uses at least one op amp. This book is Texas Instruments' complete professional-level tutorial and reference to operational amplifier theory and applications. Among the topics covered are basic op amp physics (including reviews of current and voltage division, Thevenin's theorem, and transistor models), idealized op amp operation and configuration, feedback theory and methods, single and dual supply operation, understanding op amp parameters, minimizing noise in op amp circuits, and practical applications such as instrumentation amplifiers, signal conditioning, oscillators, active filters, load and level conversions, and analog computing. There is also extensive coverage of circuit construction techniques, including circuit board design, grounding, input and output isolation, using decoupling capacitors, and frequency characteristics of passive components. The material in this book is applicable to all op amp ICs from all manufacturers, not just TI. Unlike textbook treatments of op amp theory that tend to focus on idealized op amp models and configuration, this title uses idealized models only when necessary to explain op amp theory. The bulk of this book is on real-world op amps and their applications; considerations such as thermal effects, circuit noise, circuit buffering, selection of appropriate op amps for a given application, and unexpected effects in passive components are all discussed in detail. *Published in conjunction with Texas Instruments *A single volume, professional-level guide to op amp theory and applications *Covers circuit board layout techniques for manufacturing op amp circuits.
Author: Kenneth E Kolodziej Publisher: Artech House ISBN: 1630817902 Category : Technology & Engineering Languages : en Pages : 440
Book Description
Many wireless systems could benefit from the ability to transmit and receive on the same frequency at the same time, which is known as In-Band Full-Duplex (IBFD). This technology could lead to enhanced spectral efficiency for future wireless networks, such as fifth-generation New Radio (5G NR) and beyond, and could enable capabilities and applications that were previously considered impossible, such as IBFD with phased array systems. In this exciting new book, experts from industry, academic, and federal research institutions discuss the various approaches that can be taken to suppress the inherent self-interference that is generated in IBFD systems. Both static and adaptive techniques that span across the propagation, analog and digital domains are presented. Details and measured results that encompass high-isolation antenna designs, RF, and photonic cancellation as well as signal processing approaches, which include beamforming and linear/non-linear equalization are detailed. Throughout this book, state-of-the-art IBFD systems that utilize these technologies will be provided as practical examples for various applications. Expert IBFD perspectives from multiple research organizations and companies, which would provide readers with the most accurate state-of-the-art approaches. This is the first book that dives into both the techniques that make IBFD systems possible as well as several different applications that use IBFD technology.
Author: Peter H. Ladbrooke Publisher: Artech House ISBN: 1630818690 Category : Technology & Engineering Languages : en Pages : 480
Book Description
Despite its continuing popularity, the so-called standard circuit model of compound semiconductor field-effect transistors (FETs) and high electron mobility transistors (HEMTs) is shown to have a limitation for nonlinear analysis and design: it is valid only in the static limit. When the voltages and currents are time-varying, as they must be for these devices to have any practical use, the model progressively fails for higher specification circuits. This book shows how to reform the standard model to render it fully compliant with the way FETs and HEMTs actually function, thus rendering it valid dynamically. Proof-of-principle is demonstrated for several practical circuits, including a frequency doubler and amplifiers with demanding performance criteria. Methods for extracting both the reformulated model and the standard model are described, including a scheme for re-constructing from S-parameters the bias-dependent dynamic (or RF) I(V) characteristics along which devices work in real-world applications, and as needed for the design of nonlinear circuits using harmonic-balance and time-domain simulators. The book includes a historical review of how variations on the standard model theme evolved, leading up to one of the most widely used—the Angelov (or Chalmers) model.
Author: Edmar Camargo Publisher: Artech House ISBN: 163081945X Category : Technology & Engineering Languages : en Pages : 339
Book Description
This book gives you – in one comprehensive and practical resource -- everything you need to successfully design modern and sophisticated power amplifiers at mmWave frequencies. The book provides an in-depth treatment of the design methodology for MMIC power amplifiers, then brings you step by step through the various phases of design, from the selection of technology and preliminary architecture considerations, to the effective design of the matching circuits and conversion of electrical-to-electromagnetic models. Detailed figures and numerous practical applications are included to help you gain valuable insights into these technologies and learn to identify the best path to a successful design. You’ll be guided through a range of new mmWave power applications that show particular promise to support new 5G systems, while mastering the use of GaN technology that continues to dominate the power mmWave applications due to its high power, gain, and efficiency. This is a valuable resource for power amplifier design engineers, technicians, industry R&D staff, and anyone getting into the area of power MMICs who wants to learn how to design at mmWave frequencies.
Author: Kaixue Ma Publisher: Artech House ISBN: 1685690300 Category : Technology & Engineering Languages : en Pages : 305
Book Description
Substrate Integrated Suspended Line Circuits and Systems provides a systematic overview of the new transmission line - the substrate-integrated suspension line (SISL). It details the fundamentals and classical application examples of the SISL. The basic SISL concept and structure, various passive circuits and active circuits, and front-end sub-systems are systematically introduced. Featuring research on topics such as high-performance RF/microwave/mm-wave circuits and system, this book is ideal for researchers, engineers, scientists, scholars, educators, and students. Since transmission line is a fundamental component of microwave and mm-wave circuits, the properties of a transmission line, such as losses, size, and dispersion, are vital to the performance of the whole system. Suspended line has been proved to be an excellent transmission line, as it has attractive features such as low loss, weak dispersion, high power capacity, and low effective dielectric constant. However, Conventional waveguide suspended line circuits require metal housing to form air cavities which is Substrate Integrated Suspended Line Circuits and Systems essential to the operation of suspended lines circuits. Also, the metal shell should provide mechanical support and shielding, which contribute to large size and heavy weight. Meanwhile, precise mechanical fabrication and assembling are strongly required, which brings difficulties to the design and fabrication of conventional suspended line circuits, and the manufacturing cost of suspended line circuits increases correspondingly. In this book, we will introduce a new platform of high-performance transmission line, i.e. substrate integrated suspended line (SISL). SISL keeps all the merits of the suspended line while overcomes the drawbacks of conventional waveguide suspended line circuits. Moreover, it is self-packaged and highly integrated. The basic SISL concept and structure, various passive circuits and active circuits, and front-end sub-systems will be systematically introduced. Featuring research on topics such as high-performance RF/microwave/mm-wave circuits and system, this book is ideally designed for researchers, engineers, scientists, scholars, educators, and students.
Author: Douglas Brooks
Author: Douglas Brooks
Author: Douglas Brooks
Author: Douglas Brooks
Author: Douglas G Brooks Phd
Author: Ron Mancini
Author: Kenneth E Kolodziej
Author: Peter H. Ladbrooke
Author: Edmar Camargo
Author: Kaixue Ma
Author: Jon Varteresian