2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) PDF Download
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Author: IEEE Staff Publisher: ISBN: 9781728189123 Category : Languages : en Pages :
Book Description
EPTC 2020 will feature keynotes, technical sessions, short courses, forums, exhibitions, social and networking activities It aims to provide a good coverage of technology developments in all areas of electronics packaging from design to manufacturing and operation It is a major forum for the exchange of knowledge and provides opportunities to network and meet leading experts Since its inauguration in 1997, EPTC has developed into a highly reputed electronics packaging conference in the Asia Pacific and is well attended by experts in all aspects of packaging technology from all over the world EPTC is the flagship conference of IEEE EPS in Region 10
Author: IEEE Staff Publisher: ISBN: 9781728189123 Category : Languages : en Pages :
Book Description
EPTC 2020 will feature keynotes, technical sessions, short courses, forums, exhibitions, social and networking activities It aims to provide a good coverage of technology developments in all areas of electronics packaging from design to manufacturing and operation It is a major forum for the exchange of knowledge and provides opportunities to network and meet leading experts Since its inauguration in 1997, EPTC has developed into a highly reputed electronics packaging conference in the Asia Pacific and is well attended by experts in all aspects of packaging technology from all over the world EPTC is the flagship conference of IEEE EPS in Region 10
Author: Chong Leong, Gan Publisher: Springer Nature ISBN: 3031267087 Category : Computers Languages : en Pages : 223
Book Description
This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing. In the past 40 years, memory packaging processes have evolved enormously. This book discusses the reliability and technical challenges of first-level interconnect materials, packaging processes, advanced specialty reliability testing, and characterization of interconnects. It also examines the reliability of wire bonding, lead-free solder joints such as reliability testing and data analyses, design for reliability in hybrid packaging and HBM packaging, and failure analyses. The specialty of this book is that the materials covered are not only for second-level interconnects, but also for packaging assembly on first-level interconnects and for the semiconductor back-end on 2.5D and 3D memory interconnects. This book can be used as a text for college and graduate students who have the potential to become our future leaders, scientists, and engineers in the electronics and semiconductor industry.
Author: Xiaobing Luo Publisher: John Wiley & Sons ISBN: 1119179270 Category : Technology & Engineering Languages : en Pages : 373
Book Description
A systematic guide to the theory, applications, and design of thermal management for LED packaging In Thermal Management of LED Packages and Applications, a team of distinguished engineers and researchers deliver an authoritative discussion of the fundamental theory and practical design required for LED product development. Readers will get a solid grounding in thermal management strategies and find up-to-date coverage of heat transfer fundamentals, thermal modeling, and thermal simulation and design. The authors explain cooling technologies and testing techniques that will help the reader evaluate device performance and accelerate the design and manufacturing cycle. In this all-inclusive guide to LED package thermal management, he provides the latest advances in thermal engineering design and optoelectronic devices and systems. The book also includes: A thorough introduction to thermal conduction and solutions, including discussions of thermal resistance and high thermal conductivity materials Comprehensive explorations of thermal radiation and solutions, including angular- and spectra-regulation radiative cooling Practical discussions of thermally enhanced thermal interfacial materials (TIMs) Complete treatments of hybrid thermal management in downhole devices Perfect for engineers, researchers, and industry professionals in the fields of LED packaging and heat transfer, Thermal Management of LED Packages and Applications will also benefit advanced students focusing on the design of LED product design.
Author: Peng Yu Publisher: John Wiley & Sons ISBN: 352734912X Category : Technology & Engineering Languages : en Pages : 389
Book Description
Helps readers understand the important advances in nanophotonics materials development and their latest applications This book introduces the current state of and emerging trends in the development of integrated nanophotonics. Written by three well-qualified authors, it systematically reviews the knowledge of integrated nanophotonics from theory to the most recent technological developments. It also covers the applications of integrated nanophotonics in essential areas such as neuromorphic computing, biosensing, and optical communications. Lastly, it brings together the latest advancements in the key principles of photonic integrated circuits, plus the recent advances in tackling the barriers in photonic integrated circuits. Sample topics included in this comprehensive resource include: Platforms for integrated nanophotonics, including lithium niobate nanophotonics, indium phosphide nanophotonics, silicon nanophotonics, and nonlinear optics for integrated photonics The devices and technologies for integrated nanophotonics in on-chip light sources, optical packaging of photonic integrated circuits, optical interconnects, and light processing devices Applications on neuromorphic computing, biosensing, LIDAR, and computing for AI and artificial neural network and deep learning Materials scientists, physicists, and physical chemists can use this book to understand the totality of cutting-edge theory, research, and applications in the field of integrated nanophotonics.
Author: IEEE Staff Publisher: ISBN: 9781728161624 Category : Languages : en Pages :
Book Description
EPEPS is the premier international conference on advanced and emerging issues in electrical modeling, analysis and design of electronic interconnections, packages and systems It also focuses on new methodologies and design techniques for evaluating and ensuring signal, power and thermal integrity in high speed designs EPEPS is jointly sponsored by the IEEE Electronics Packaging Society and IEEE Microwave Theory and Techniques Society
Author: Norbert Streitz Publisher: Springer Nature ISBN: 3030503445 Category : Computers Languages : en Pages : 709
Book Description
This conference proceeding LNCS 12203 constitutes the refereed proceedings of the 12th International Conference on Cross-Cultural Design, CCD 2020, held as part of HCI International 2020 in Copenhagen, Denmark in July 2020. The conference was held virtually due to the corona pandemic. The total of 1439 papers and 238 posters included in the 40 HCII 2020 proceedings volumes was carefully reviewed and selected from 6326 submissions. The regular papers of DAPI 2020, Distributed, Ambient and Pervasive Interactions, presented in this volume were organized in topical sections named: Design Approaches, Methods and Tools, Smart Cities and Landscapes, Well-being, Learning and Culture in Intelligent Environments and much more.
Author: IEEE Staff
Author: IEEE Staff
Author: Chong Leong, Gan
Author: Xiaobing Luo
Author: Peng Yu
Author: 
Author: IEEE Staff
Author: 
Author: IEEE Staff
Author: Norbert Streitz
Author: