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Author:
Publisher:
ISBN: 9781538630426
Category : Electronic packaging
Languages : en
Pages :

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Author: IEEE Staff
Publisher:
ISBN: 9781538630433
Category :
Languages : en
Pages :

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Advanced Packaging Advanced Flip chip, 2 5D & 3D, PoP, embedded passives & actives on substrates, System in Packaging, embedded chip packaging technologies, Panel level packaging, RF, Microwave & Millimeter wave, Power and Rugged Electronics Packaging etc TSV Wafer Level Packaging Wafer level packaging ( Fan in Fan out), embedded chip packaging, 2 5D 3D integration, TSV, Silicon & Glass interposer, RDL, bumping technologies, etc Interconnection Technologies Au Ag Cu Al Wire bond Wedge bond technology, Flip chip & Cu pillar, solder alternatives (ICP, ACP, ACF, NCP, ICA), Cu to Cu, Wafer level bonding & die attachment (Pb free) etc Emerging Technologies Packaging technologies for MEMS, biomedical, optoelectronics, Internet of things, photo voltaic, printed electronics, wearable electronics, Photonics, LED, etc Materials and Processing advanced materials such 3D materials, photoresist, polymer dielectrics, solder materials, die attach, underfill, Substrates, etc

Author: Peng Yu
Publisher: John Wiley & Sons
ISBN: 352734912X
Category : Technology & Engineering
Languages : en
Pages : 389

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Book Description
Helps readers understand the important advances in nanophotonics materials development and their latest applications This book introduces the current state of and emerging trends in the development of integrated nanophotonics. Written by three well-qualified authors, it systematically reviews the knowledge of integrated nanophotonics from theory to the most recent technological developments. It also covers the applications of integrated nanophotonics in essential areas such as neuromorphic computing, biosensing, and optical communications. Lastly, it brings together the latest advancements in the key principles of photonic integrated circuits, plus the recent advances in tackling the barriers in photonic integrated circuits. Sample topics included in this comprehensive resource include: Platforms for integrated nanophotonics, including lithium niobate nanophotonics, indium phosphide nanophotonics, silicon nanophotonics, and nonlinear optics for integrated photonics The devices and technologies for integrated nanophotonics in on-chip light sources, optical packaging of photonic integrated circuits, optical interconnects, and light processing devices Applications on neuromorphic computing, biosensing, LIDAR, and computing for AI and artificial neural network and deep learning Materials scientists, physicists, and physical chemists can use this book to understand the totality of cutting-edge theory, research, and applications in the field of integrated nanophotonics.

Author: Norbert Streitz
Publisher: Springer Nature
ISBN: 3030503445
Category : Computers
Languages : en
Pages : 709

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Book Description
This conference proceeding LNCS 12203 constitutes the refereed proceedings of the 12th International Conference on Cross-Cultural Design, CCD 2020, held as part of HCI International 2020 in Copenhagen, Denmark in July 2020. The conference was held virtually due to the corona pandemic. The total of 1439 papers and 238 posters included in the 40 HCII 2020 proceedings volumes was carefully reviewed and selected from 6326 submissions. The regular papers of DAPI 2020, Distributed, Ambient and Pervasive Interactions, presented in this volume were organized in topical sections named: Design Approaches, Methods and Tools, Smart Cities and Landscapes, Well-being, Learning and Culture in Intelligent Environments and much more.

Author: Woon-Hong Yeo
Publisher: Elsevier
ISBN: 0323993680
Category : Technology & Engineering
Languages : en
Pages : 590

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Approx.630 pages Approx.630 pages

Author: Frank Suli
Publisher: Woodhead Publishing
ISBN: 008102391X
Category : Technology & Engineering
Languages : en
Pages : 490

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Electronic Enclosures, Housings and Packages considers the problem of heat management for electronics from an encasement perspective. It addresses enclosures and their applications for industrial electronics, as well as LED lighting solutions for stationary and mobile markets. The book introduces fundamental concepts and defines dimensions of success in electrical enclosures. Other chapters discuss environmental considerations, shielding, standardization, materials selection, thermal management, product design principles, manufacturing techniques and sustainability. Final chapters focus on business fundamentals by outlining successful technical propositions and potential future directions. Introduces the concepts of materials recycling and sustainability to electronic enclosures Provides thorough coverage of all technical aspects relating to the design and manufacturing of electronic packaging Includes practical information on environmental considerations, shielding, standardization, materials selection, and more

Author: John H. Lau
Publisher: Springer Nature
ISBN: 9811999171
Category : Technology & Engineering
Languages : en
Pages : 542

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Book Description
The book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as chip partitioning, chip splitting, multiple system and heterogeneous integration with TSV-interposers, multiple system and heterogeneous integration with TSV-less interposers, chiplets lateral communication, system-in-package, fan-out wafer/panel-level packaging, and various Cu-Cu hybrid bonding. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.

Author: Marcin Słoma
Publisher: Walter de Gruyter GmbH & Co KG
ISBN: 3110793601
Category : Technology & Engineering
Languages : en
Pages : 154

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Book Description
Additive manufacturing, also called rapid prototyping or 3D printing is a disruptive manufacturing technique with a significant impact in electronics. With 3D printing, bulk objects with circuitry are embedded in the volume of an element or conformally coated on the surface of existing parts, allowing design and manufacturing of smaller and lighter products with fast customisation. The book covers both materials selection and techniques. The scope also covers the research areas of additive manufacturing of passive and active components, sensors, energy storage, bioelectronics and more.

Author: Charis M. Galanakis
Publisher: Springer Nature
ISBN: 303071571X
Category : Technology & Engineering
Languages : en
Pages : 429

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Book Description
Agriculture and food systems, forestry, the marine and the bio-based sectors are at the very heart of the climate change crisis. Evidence on climate change reveals that it will affect farming first, through changes to rainfall regimes, rising temperatures, the variability and seasonality of the climate and the occurrence of more frequent extreme events (heatwaves, droughts, storms and floods). In addition to findings ways to mitigate greenhouse gas emissions, farmers will need to develop farming systems resilient to fluctuating environmental and socioeconomic conditions. It is thus a great challenge to support ambitious climate targets while satisfying the needs for food, feed, bio-based products and energy for a global population projected to reach 10 billion by 2030. Few books on the market integrate environment studies and climate-smart food production. This book fills the knowledge gap by covering all the relevant aspects in one reference: starting with microclimate management, climate change and food systems, and resilience of mixed farming and agroforestry systems, chapters address agricultural soil management, integrated water management in small agricultural catchments, citizen-driven food system approaches in cities, and ICT-enabled agri-food systems. By focusing on the most recent advances in the field while analyzing the potential of already applied practices, this book can serve as a handbook for regulators and researchers looking to understand all aspects of food production and distribution in this changing environment.

Author: Gopal Rawat
Publisher: Bentham Science Publishers
ISBN: 9815136631
Category : Science
Languages : en
Pages : 449

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Book Description
Nanoelectronics Devices: Design, Materials, and Applications provides information about the progress of nanomaterial and nanoelectronic devices and their applications in diverse fields (including semiconductor electronics, biomedical engineering, energy production and agriculture). The book is divided into two parts. The editors have included a blend of basic and advanced information with references to current research. The book is intended as an update for researchers and industry professionals in the field of electronics and nanotechnology. It can also serve as a reference book for students taking advanced courses in electronics and technology. The editors have included MCQs for evaluating the readers’ understanding of the topics covered in the book. Topics covered in Part 1 include basic knowledge on nanoelectronics with examples of testing different device parameters. - The present, past, and future of nanoelectronics, - An introduction to Nanoelectronics and applicability of Moore's law - Transport of charge carrier, electrode, and measurement of device parameters - Fermi level adjustment in junction less transistor, - Non-polar devices and their simulation - The negative capacitance in MOSFET devices - Effect of electrode in the device operation - Second and Sixth group semiconductors, - FinFET principal and future, Electronics and optics integration for fast processing and data communication - Batteryless photo detectors - Solar cell fabrication and applications - Van der Waals assembled nanomaterials