Interconnect Noise Optimization in Nanometer Technologies PDF Download

Author: Mohamed Elgamel
Publisher: Springer Science & Business Media
ISBN: 0387293663
Category : Technology & Engineering
Languages : en
Pages : 145

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Book Description
Presents a range of CAD algorithms and techniques for synthesizing and optimizing interconnect Provides insight & intuition into layout analysis and optimization for interconnect in high speed, high complexity integrated circuits

Author: Nadine Azemard
Publisher: Springer
ISBN: 3540744428
Category : Computers
Languages : en
Pages : 586

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Book Description
This volume features the refereed proceedings of the 17th International Workshop on Power and Timing Modeling, Optimization and Simulation. Papers cover high level design, low power design techniques, low power analog circuits, statistical static timing analysis, power modeling and optimization, low power routing optimization, security and asynchronous design, low power applications, modeling and optimization, and more.

Author: Bing Lu
Publisher: Springer Science & Business Media
ISBN: 1475734158
Category : Computers
Languages : en
Pages : 292

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Book Description
Introduction The exponential scaling of feature sizes in semiconductor technologies has side-effects on layout optimization, related to effects such as inter connect delay, noise and crosstalk, signal integrity, parasitics effects, and power dissipation, that invalidate the assumptions that form the basis of previous design methodologies and tools. This book is intended to sample the most important, contemporary, and advanced layout opti mization problems emerging with the advent of very deep submicron technologies in semiconductor processing. We hope that it will stimulate more people to perform research that leads to advances in the design and development of more efficient, effective, and elegant algorithms and design tools. Organization of the Book The book is organized as follows. A multi-stage simulated annealing algorithm that integrates floorplanning and interconnect planning is pre sented in Chapter 1. To reduce the run time, different interconnect plan ning approaches are applied in different ranges of temperatures. Chapter 2 introduces a new design methodology - the interconnect-centric design methodology and its centerpiece, interconnect planning, which consists of physical hierarchy generation, floorplanning with interconnect planning, and interconnect architecture planning. Chapter 3 investigates a net-cut minimization based placement tool, Dragon, which integrates the state of the art partitioning and placement techniques.

Author: Dhanasekharan Natarajan
Publisher: Springer Nature
ISBN: 3030361969
Category : Technology & Engineering
Languages : en
Pages : 313

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Book Description
This book presents the fundamentals of digital electronics in a focused and comprehensivemanner with many illustrations for understanding of the subject with high clarity. DigitalSignal Processing (DSP) application information is provided for many topics of the subjectto appreciate the practical significance of learning. To summarize, this book lays afoundation for students to become DSP engineers.

Author: Rohit Dhiman
Publisher: Springer
ISBN: 813222132X
Category : Technology & Engineering
Languages : en
Pages : 113

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Book Description
The book provides a detailed analysis of issues related to sub-threshold interconnect performance from the perspective of analytical approach and design techniques. Particular emphasis is laid on the performance analysis of coupling noise and variability issues in sub-threshold domain to develop efficient compact models. The proposed analytical approach gives physical insight of the parameters affecting the transient behavior of coupled interconnects. Remedial design techniques are also suggested to mitigate the effect of coupling noise. The effects of wire width, spacing between the wires, wire length are thoroughly investigated. In addition, the effect of parameters like driver strength on peak coupling noise has also been analyzed. Process, voltage and temperature variations are prominent factors affecting sub-threshold design and have also been investigated. The process variability analysis has been carried out using parametric analysis, process corner analysis and Monte Carlo technique. The book also provides a qualitative summary of the work reported in the literature by various researchers in the design of digital sub-threshold circuits. This book should be of interest for researchers and graduate students with deeper insights into sub-threshold interconnect models in particular. In this sense, this book will best fit as a text book and/or a reference book for students who are initiated in the area of research and advanced courses in nanotechnology, interconnect design and modeling.

Author: Afreen Khursheed
Publisher: CRC Press
ISBN: 100050431X
Category : Technology & Engineering
Languages : en
Pages : 187

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Book Description
This textbook comprehensively covers on-chip interconnect dimension and application of carbon nanomaterials for modeling VLSI interconnect and buffer circuits. It provides analysis of ultra-low power high speed nano-interconnects based on different facets such as material modeling, circuit modeling and the adoption of repeater insertion strategies and measurement techniques. It covers important topics including on-chip interconnects, interconnect modeling, electrical impedance modeling of on-chip interconnects, modeling of repeater buffer and variability analysis. Pedagogical features including solved problems and unsolved exercises are interspersed throughout the text for better understanding. Aimed at senior undergraduate and graduate students in the field of electrical engineering, electronics and communications engineering for courses on Advanced VLSI Interconnects/Advanced VLSI Design/VLSI Interconnects/VLSI Design Automation and Techniques, this book: Provides comprehensive coverage of fundamental concepts related to nanotube transistors and interconnects. Discusses properties and performance of practical nanotube devices and related applications. Covers physical and electrical phenomena of carbon nanotubes, as well as applications enabled by this nanotechnology. Discusses the structure, properties, and characteristics of graphene-based on-chip interconnect. Examines interconnect power and interconnect delay issues arising due to downscaling of device size.

Author: Mohamed Elgamel
Publisher: Springer
ISBN: 9780387258706
Category : Technology & Engineering
Languages : en
Pages : 137

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Book Description
Presents a range of CAD algorithms and techniques for synthesizing and optimizing interconnect Provides insight & intuition into layout analysis and optimization for interconnect in high speed, high complexity integrated circuits

Author: Basel Halak
Publisher: Springer
ISBN: 3319768042
Category : Technology & Engineering
Languages : en
Pages : 250

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Book Description
This book discusses the design principles of physically unclonable functions (PUFs) and how these can be employed in hardware-based security applications, in particular, the book provides readers with a comprehensive overview of security threats and existing countermeasures. This book has many features that make it a unique source for students, engineers and educators, including more than 80 problems and worked exercises, in addition to, approximately 200 references, which give extensive direction for further reading.

Author: David C. Wyld
Publisher: Springer Science & Business Media
ISBN: 3642301576
Category : Technology & Engineering
Languages : en
Pages : 1050

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Book Description
The International conference series on Computer Science, Engineering & Applications (ICCSEA) aims to bring together researchers and practitioners from academia and industry to focus on understanding computer science, engineering and applications and to establish new collaborations in these areas. The Second International Conference on Computer Science, Engineering & Applications (ICCSEA-2012), held in Delhi, India, during May 25-27, 2012 attracted many local and international delegates, presenting a balanced mixture of intellect and research both from the East and from the West. Upon a strenuous peer-review process the best submissions were selected leading to an exciting, rich and a high quality technical conference program, which featured high-impact presentations in the latest developments of various areas of computer science, engineering and applications research.

Author: IEEE Circuits and Systems Society
Publisher: Institute of Electrical & Electronics Engineers(IEEE)
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 974

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Book Description
These volumes relate to matters discussed during the 2003 IEEE International Symposium on Circuits and Systems, such as: analogue circuits and signal processing; communications; multimedia systems and applications; general and nonlinear circuits and systems; and neural networks and systems.