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Author: Lei Zhou Publisher: ISBN: 9781109675092 Category : Languages : en Pages : 119
Book Description
Silicon-based integrated circuits used in the wireless technology have a great impact on our world. Moreover, such trend is continuing with ever-decreasing size of transistors. High speed wireless communication links are expected to become popular within most mobile devices in the next few years. On the other side, millimeter-wave (MMW) frequency has always been the terrain dominated by III-V compound semiconductor technology. However, the cost and low manufacturing yield of such systems prevent its commercialized use for new exciting applications, such as automotive intelligent system and imaging for public security and medical application. As the technology scaling in silicon, the increasing process ft and higher level of integration are promising to build lower cost, smaller sized MMW systems. This dissertation is following the goal to design and implement several prototype silicon-based integrated circuits at different technology nodes to address the key challenges faced by silicon both in circuit- and system-levels, therefore pave the path towards the fully-integrated systems for those emerging applications. A carrier-less RF-correlation-based impulse radio ultra-wideband (IR-UWB) transceiver front-end designed in 130nm CMOS process is presented. Timing synchronization and coherent demodulation are implemented directly in the RF domain. In order to solve the extremely large dynamic requirement of delay for RF synchronization, a template-based delay generation scheme is proposed and a 25ps timing resolution is achieved with a delay range of 500ps by a two-step timing synchronizer. The TRX achieves a maximum data rate of 2Gbps, while requiring only 51.5pJ/pulse in the TX mode and 72.9pJ/pulse in the RX mode. Finally a W-band receiver chipset for passive millimeter-wave imaging in a 65-nm standard CMOS technology is presented. The receiver design addresses the high 1/f noise issue in the advanced CMOS technology. An LO generation scheme is proposed to make it suitable for use in multi-pixel systems. In addition, the noise performance of the receiver is further improved by optimum biasing of transistors of the detector to achieve the highest responsivity and lowest NEP. The receiver chipset achieves a Dicke NETD of 0.52K, demonstrating the potential of CMOS for future low-cost portable passive imaging cameras.
Author: Lei Zhou Publisher: ISBN: 9781109675092 Category : Languages : en Pages : 119
Book Description
Silicon-based integrated circuits used in the wireless technology have a great impact on our world. Moreover, such trend is continuing with ever-decreasing size of transistors. High speed wireless communication links are expected to become popular within most mobile devices in the next few years. On the other side, millimeter-wave (MMW) frequency has always been the terrain dominated by III-V compound semiconductor technology. However, the cost and low manufacturing yield of such systems prevent its commercialized use for new exciting applications, such as automotive intelligent system and imaging for public security and medical application. As the technology scaling in silicon, the increasing process ft and higher level of integration are promising to build lower cost, smaller sized MMW systems. This dissertation is following the goal to design and implement several prototype silicon-based integrated circuits at different technology nodes to address the key challenges faced by silicon both in circuit- and system-levels, therefore pave the path towards the fully-integrated systems for those emerging applications. A carrier-less RF-correlation-based impulse radio ultra-wideband (IR-UWB) transceiver front-end designed in 130nm CMOS process is presented. Timing synchronization and coherent demodulation are implemented directly in the RF domain. In order to solve the extremely large dynamic requirement of delay for RF synchronization, a template-based delay generation scheme is proposed and a 25ps timing resolution is achieved with a delay range of 500ps by a two-step timing synchronizer. The TRX achieves a maximum data rate of 2Gbps, while requiring only 51.5pJ/pulse in the TX mode and 72.9pJ/pulse in the RX mode. Finally a W-band receiver chipset for passive millimeter-wave imaging in a 65-nm standard CMOS technology is presented. The receiver design addresses the high 1/f noise issue in the advanced CMOS technology. An LO generation scheme is proposed to make it suitable for use in multi-pixel systems. In addition, the noise performance of the receiver is further improved by optimum biasing of transistors of the detector to achieve the highest responsivity and lowest NEP. The receiver chipset achieves a Dicke NETD of 0.52K, demonstrating the potential of CMOS for future low-cost portable passive imaging cameras.
Author: Vipul Jain Publisher: ISBN: 9781109356694 Category : Languages : en Pages : 163
Book Description
Since the invention of the integrated circuit, the semiconductor industry has revolutionized the world in ways no one had ever anticipated. With the advent of silicon technologies, consumer electronics became light-weight and affordable and paved the way for an Information Communication-Entertainment age. While silicon almost completely replaced compound semiconductors from these markets, it has been unable to compete in areas with more stringent requirements due to technology limitations. One of these areas is automotive radar sensors, which will enable next-generation collision warning systems in automobiles. A low-cost implementation is absolutely essential for widespread use of these systems, which leads us to the subject of this dissertation--silicon-based solutions for automotive radars. This dissertation presents architectures and design techniques for mm-wave automotive radar transceivers. Several fully-integrated transceivers and receivers operating at 22-29 GHz and 77-81 GHz are demonstrated in both CMOS and SiGe BiCMOS technologies. Excellent performance is achieved indicating the suitability of silicon technologies for automotive radar sensors. The first CMOS 22-29-GHz pulse-radar receiver front-end for ultra-wideband radars is presented. The chip includes a low noise amplifier, I/Q mixers, quadrature voltage-controlled oscillators, pulse formers and variable-gain amplifiers. Fabricated in 0.18-um CMOS, the receiver achieves a conversion gain of 35 38.1 dB and a noise figure of 5.5 7.4 dB. Integration of multi-mode multi-band transceivers on a single chip will enable next-generation low-cost automotive radar sensors. Two highly-integrated silicon ICs are designed in a 0.18-um BiCMOS technology. These designs are also the first reported demonstrations of mm-wave circuits with high-speed digital circuits on the same chip. The first mm-wave dual-band frequency synthesizer and transceiver, operating in the 24-GHz and 77-GHz bands, are demonstrated. All circuits except the oscillators are shared between the two bands. A multi-functional injection-locked circuit is used after the oscillators to reconfigure the division ratio inside the phase-locked loop. The synthesizer is suitable for integration in automotive radar transceivers and heterodyne receivers for 94-GHz imaging applications. The transceiver chip includes a dual-band low noise amplifier, a shared downconversion chain, dual-band pulse formers, power amplifiers, a dual-band frequency synthesizer and a high-speed programmable baseband pulse generator. Radar functionality is demonstrated using loopback measurements.
Author: IEEE Staff Publisher: ISBN: 9781665430821 Category : Languages : en Pages :
Book Description
RFIC is the premier IC Conference focused on the latest developments in RF Microwave, and Millimeter Wave Integrated Circuit Technology and Innovation
Author: Duixian Liu Publisher: John Wiley & Sons ISBN: 1119556635 Category : Technology & Engineering Languages : en Pages : 416
Book Description
A comprehensive guide to antenna design, manufacturing processes, antenna integration, and packaging Antenna-in-Package Technology and Applications contains an introduction to the history of AiP technology. It explores antennas and packages, thermal analysis and design, as well as measurement setups and methods for AiP technology. The authors—well-known experts on the topic—explain why microstrip patch antennas are the most popular and describe the myriad constraints of packaging, such as electrical performance, thermo-mechanical reliability, compactness, manufacturability, and cost. The book includes information on how the choice of interconnects is governed by JEDEC for automatic assembly and describes low-temperature co-fired ceramic, high-density interconnects, fan-out wafer level packaging–based AiP, and 3D-printing-based AiP. The book includes a detailed discussion of the surface laminar circuit–based AiP designs for large-scale mm-wave phased arrays for 94-GHz imagers and 28-GHz 5G New Radios. Additionally, the book includes information on 3D AiP for sensor nodes, near-field wireless power transfer, and IoT applications. This important book: • Includes a brief history of antenna-in-package technology • Describes package structures widely used in AiP, such as ball grid array (BGA) and quad flat no-leads (QFN) • Explores the concepts, materials and processes, designs, and verifications with special consideration for excellent electrical, mechanical, and thermal performance Written for students in electrical engineering, professors, researchers, and RF engineers, Antenna-in-Package Technology and Applications offers a guide to material selection for antennas and packages, antenna design with manufacturing processes and packaging constraints, antenna integration, and packaging.
Author: Jaco du Preez Publisher: Springer ISBN: 3319350684 Category : Technology & Engineering Languages : en Pages : 155
Book Description
This book comprehensively reviews the state of the art in millimeter-wave antennas, traces important recent developments and provides information on a wide range of antenna configurations and applications. While fundamental theoretical aspects are discussed whenever necessary, the book primarily focuses on design principles and concepts, manufacture, measurement techniques, and practical results. Each of the various antenna types scalable to millimeter-wave dimensions is considered individually, with coverage of leaky-wave and surface-wave antennas, printed antennas, integrated antennas, and reflector and lens systems. The final two chapters address the subject from a systems perspective, providing an overview of supporting circuitry and examining in detail diverse millimeter-wave applications, including high-speed wireless communications, radio astronomy, and radar. The vast amount of information now available on millimeter-wave systems can be daunting for researchers and designers entering the field. This book offers readers essential guidance, helping them to gain a thorough understanding based on the most recent research findings and serving as a sound basis for informed decision-making.
Author: Luca Roselli Publisher: Cambridge University Press ISBN: 1107030404 Category : Computers Languages : en Pages : 289
Book Description
Learn how new materials and electronics technologies can make RFID systems more energy efficient and environmentally friendly. Experts show you how energy scavenging, passive/chipless RFID, RFID passive sensors, networked RFID, energy harvesting, organic devices, and wide area electronics can be used to develop green solutions for the Internet of Things.
Author: Thomas Kürner Publisher: Springer Nature ISBN: 3030737381 Category : Science Languages : en Pages : 510
Book Description
This book describes the fundamentals of THz communications, spanning the whole range of applications, propagation and channel models, RF transceiver technology, antennas, baseband techniques, and networking interfaces. The requested data rate in wireless communications will soon reach from 100 Gbit/s up to 1 Tbps necessitating systems with ultra-high bandwidths of several 10s of GHz which are available only above 200 GHz. In the last decade, research at these frequency bands has made significant progress, enabling mature experimental demonstrations of so-called THz communications, which are thus expected to play a vital role in future wireless networks. In addition to chapters by leading experts on the theory, modeling, and implementation of THz communication technology, the book also features the latest experimental results and addresses standardization and regulatory aspects. This book will be of interest to both academic researchers and engineers in the telecommunications industry.
Author: Christopher Bowick Publisher: Elsevier ISBN: 0080516289 Category : Technology & Engineering Languages : en Pages : 177
Book Description
Essential reading for experts in the field of RF circuit design and engineers needing a good reference. This book provides complete design procedures for multiple-pole Butterworth, Chebyshev, and Bessel filters. It also covers capacitors, inductors, and other components with their behavior at RF frequencies discussed in detail. Provides complete design procedures for multiple-pole Butterworth, Chebyshev, and Bessel filters Covers capacitors, inductors, and other components with their behavior at RF frequencies discussed in detail
Author: Les Besser Publisher: Artech House ISBN: 9781580536752 Category : Technology & Engineering Languages : es Pages : 582
Book Description
Annotation In today's globally competitive wireless industry, the design-to-production cycle is critically important. The first of a two-volume set, this leading-edge book takes a practical approach to RF (radio frequency) circuit design, offering a complete understanding of the fundamental concepts practitioners need to know and use for their work in the field.
Author: Lei Zhou
Author: Lei Zhou
Author: Vipul Jain
Author: Vadim Issakov
Author: IEEE Staff
Author: Duixian Liu
Author: Jaco du Preez
Author: Luca Roselli
Author: Thomas Kürner
Author: Christopher Bowick
Author: Les Besser