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Author: Douglas Brooks Publisher: Prentice Hall Professional ISBN: 9780131418844 Category : Computers Languages : en Pages : 418
Book Description
Complicated concepts explained succinctly and in laymen's terms to both experienced and novice PCB designers. Numerous examples allow reader to visualize how high-end software simulators see various types of SI problems and then their solutions. Author is a frequent and recognized seminar leader in the industry.
Author: Douglas Brooks Publisher: Prentice Hall Professional ISBN: 9780131418844 Category : Computers Languages : en Pages : 418
Book Description
Complicated concepts explained succinctly and in laymen's terms to both experienced and novice PCB designers. Numerous examples allow reader to visualize how high-end software simulators see various types of SI problems and then their solutions. Author is a frequent and recognized seminar leader in the industry.
Author: Mohamed Elgamel Publisher: Springer Science & Business Media ISBN: 0387293663 Category : Technology & Engineering Languages : en Pages : 145
Book Description
Presents a range of CAD algorithms and techniques for synthesizing and optimizing interconnect Provides insight & intuition into layout analysis and optimization for interconnect in high speed, high complexity integrated circuits
Author: Suny Li (Li Yang) Publisher: John Wiley & Sons ISBN: 1119045932 Category : Technology & Engineering Languages : en Pages : 508
Book Description
An advanced reference documenting, in detail, every step of a real System-in-Package (SiP) design flow Written by an engineer at the leading edge of SiP design and implementation, this book demonstrates how to design SiPs using Mentor EE Flow. Key topics covered include wire bonding, die stacks, cavity, flip chip and RDL (redistribution layer), Embedded Passive, RF design, concurrent design, Xtreme design, 3D real-time DRC (design rule checking), and SiP manufacture. Extensively illustrated throughout, System in Package Design and Simulation covers an array of issues of vital concern for SiP design and fabrication electronics engineers, as well as SiP users, including: Cavity and sacked dies design FlipChip and RDL design Routing and coppering 3D Real-Time DRC check SiP simulation technology Mentor SiP Design and Simulation Platform Designed to function equally well as a reference, tutorial, and self-study, System in Package Design and Simulation is an indispensable working resource for every SiP designer, especially those who use Mentor design tools.
Author: Suny Li Publisher: Springer Nature ISBN: 9811900833 Category : Technology & Engineering Languages : en Pages : 867
Book Description
This book is a comprehensive SiP design guide book. It is divided into three parts: concept and technology, design and simulation, project and case, for a total of 30 chapters. In Part one, the author proposes some new original concepts and thoughts, such as Function Density Law,Si3P and 4D integration. Part one also covers the latest technology of SiP and Advanced Packaging. Part two covers the latest SiP and Advanced Packaging design and simulation technologies, such as wire bonding, multi-step cavity, chip stacking, 2.5D TSV, 3D TSV, RDL, Fan- In, Fan-Out, Flip Chip, Embedded Passive, Embedded Chip, RF design, Rigid-Flex design, 4D SiP design, Multi-layout project and Team design, as well as SI, PI, thermal simulation, electrical verification and physical verification. Based on a real design case, part three introduces the design, simulation and implementation methods of different types of SiP, which has a -important reference significance for the research and development of SiP projects. This book comprehensively and deeply expounds the latest development, design ideas and design methods of contemporary SiP technology from three aspects: concept and technology, design and simulation, project and case. Through the detailed introduction of new concepts, design methods, actual projects and cases, this book describes the whole process of SiP products from the beginning of conception to the final realization and makes readers benefit from it.
Author: David Terrell Publisher: Newnes ISBN: 9780750672825 Category : Science Languages : en Pages : 360
Book Description
Based on over twenty years of hands-on experience with electromagnetic interference (EMI), Digital Design for Interference Specifications provides circuit designers concrete rules that can be applied immediately to the design of new digital products. The authors' techniques emphasize EMI source suppression at the printed circuit board level and considers shielding only as a last resort. The material is written in a how-to format with brief qualitative explanations of why or how design recommendations suppress emissions or reduce susceptibility. The described approaches toward design and prevention of EMI will save manufacturers time, product cost, and enhance manufacturability. Best of all, designers will not have to be EMI gurus to implement these processes but they will definitely look like experts when the final outcome is assessed. Digital Design for Interference Specifications is a very well written book targeted directly toward circuit designers and EMI professionals. The authors built a consulting company out of the knowledge presented in the book working with a huge list of clients over the years. The material is written to directly apply to circuit designers' projects helping them save money and time on each design. The book is heavily and clearly illustrated. A practical, hands-on guide to EMI suppression and prevention. Written by circuit designers for use by circuit designers. Heavily illustrated and easy to read.
Author: Publisher: ISBN: Category : Languages : en Pages : 152
Book Description
For more than 20 years, Network World has been the premier provider of information, intelligence and insight for network and IT executives responsible for the digital nervous systems of large organizations. Readers are responsible for designing, implementing and managing the voice, data and video systems their companies use to support everything from business critical applications to employee collaboration and electronic commerce.
Author: Thanh T. Tran Publisher: Springer Nature ISBN: 3031049543 Category : Technology & Engineering Languages : en Pages : 225
Book Description
The new edition of this textbook is based on Dr. Thanh T. Tran’s 10+ years’ experience teaching high-speed digital and analog design courses at Rice University and 30+ years’ experience working in high-speed system design, including signal and power integrity in digital signal processing (DSP), computer, and embedded system. The book provides hands-on, practical instruction on high-speed digital and analog design for students and working engineers. The author first presents good high-speed digital and analog design practices that minimize both component and system noise and ensure system design success. He then presents guidelines to be used throughout the design process to reduce noise and radiation and to avoid common pitfalls while improving quality and reliability. The book is filled with tips on design and system simulation that minimize late stage redesign costs and product shipment delays. Hands-on design examples focusing on audio, video, analog filters, DDR memory, and power supplies are featured throughout. In addition, the author provides a practical approach to design multi-gigahertz high-speed serial busses (USB-C, PCIe, HDMI, DP) and simulate printed circuit board insertion and return loss using s-parameter models.
Author: Douglas Brooks
Author: Douglas Brooks
Author: Mohamed Elgamel
Author: Suny Li (Li Yang)
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Author: 
Author: 
Author: Suny Li
Author: David Terrell
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Author: Thanh T. Tran