Signal Integrity Issues and Printed Circuit Board Design PDF Download

Author: Douglas Brooks
Publisher: Prentice Hall Professional
ISBN: 9780131418844
Category : Computers
Languages : en
Pages : 418

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Book Description
Complicated concepts explained succinctly and in laymen's terms to both experienced and novice PCB designers. Numerous examples allow reader to visualize how high-end software simulators see various types of SI problems and then their solutions. Author is a frequent and recognized seminar leader in the industry.

Author: Stephen C. Thierauf
Publisher: Artech House
ISBN: 9781580538466
Category : Technology & Engineering
Languages : en
Pages : 272

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Book Description
This leading-edge circuit design resource offers the knowledge needed to quickly pinpoint transmission problems that can compromise circuit design. Discusses both design and debug issues at gigabit per second data rates.

Author: Vikas Shukla
Publisher:
ISBN: 9780982136904
Category : Printed circuits
Languages : en
Pages : 264

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Book Description

Author: Fadi Deek
Publisher:
ISBN: 9780998288536
Category :
Languages : en
Pages : 64

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Book Description
Signal integrity issues remain a concern for many in the electronics industry. This micro eBook details the importance of eliminating signal integrity challenges. Written by signal integrity engineer Fadi Deek of Mentor, A Siemens Business, the chapters explore four possible signal integrity problems using an understanding of essential signal integrity principles.Deek explores how to reach effective design solutions and make strong engineering tradeoffs through analysis techniques, best design principles, and software tools to achieve accurate simulations and measurements. This eBook has something to offer for any engineer interested in identifying problems, root causes, and solutions surrounding electronic transmissions.

Author: Douglas Brooks
Publisher: Artech House
ISBN: 1630818615
Category : Technology & Engineering
Languages : en
Pages : 246

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Book Description
A very important part of printed circuit board (PCB) design involves sizing traces and vias to carry the required current. This exciting new book will explore how hot traces and vias should be and what board, circuit, design, and environmental parameters are the most important. PCB materials (copper and dielectrics) and the role they play in the heating and cooling of traces are covered. The IPC curves found in IPC 2152, the equations that fit those curves and computer simulations that fit those curves and equations are detailed. Sensitivity analyses that show what happens when environments are varied, including adjacent traces and planes, changing trace lengths, and thermal gradients are presented. Via temperatures and what determines them are explored, along with fusing issues and what happens when traces are overloaded. Voltage drops across traces and vias, the thermal effects going around right-angle corners, and frequency effects are covered. Readers learn how to measure the thermal conductivity of dielectrics and how to measure the resistivity of copper traces and why many prior attempts to do so have been doomed to failure. Industrial CT Scanning, and whether or not they might replace microsections for measuring trace parameters are also considered.

Author: Douglas Brooks
Publisher: Pearson Education
ISBN: 0133415333
Category : Technology & Engineering
Languages : en
Pages : 342

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Book Description
Building on his widely praised seminars, Brooks explains what current is, how it flows, and how it reacts. He begins by reviewing the nature of current, and then explains current flow in basic circuits, discusses sources that supply and drive current, and addresses the unique problems associated with current on PCBs.

Author: Xing-Chang Wei
Publisher: CRC Press
ISBN: 1315305852
Category : Computers
Languages : en
Pages : 266

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Book Description
Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging presents the electromagnetic modelling and design of three major electromagnetic compatibility (EMC) issues related to the high-speed printed circuit board (PCB) and electronic packages: signal integrity (SI), power integrity (PI), and electromagnetic interference (EMI). The emphasis is put on two essential passive components of PCBs and packages: the power distribution network and the signal distribution network. This book includes two parts. Part one talks about the field-circuit hybrid methods used for the EMC modeling, including the modal method, the integral equation method, the cylindrical wave expansion method and the de-embedding method. Part two illustrates EMC design methods and explores the applications of novel metamaterials and two-dimensional materials on traditional EMC problems. This book is designed to enhance worthwhile electromagnetic theory and mathematical methods for practical engineers and to train students with advanced EMC applications.

Author: Stephen C. Thierauf
Publisher: Artech House
ISBN: 1580531318
Category : Technology & Engineering
Languages : en
Pages : 243

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Book Description
As circuit boards are increasingly required to transmit signals at higher and higher speeds, signal and power integrity become increasingly crucial. Rules of thumb that you have used over and over again to prevent signal loss no longer apply to these new, high-speed, high-density circuit designs. This leading-edge circuit design resource offers you the knowledge needed to quickly pinpoint transmission problems that can compromise your entire circuit design. Discussing both design and debug issues at gigabit per second data rates, the book serves as a practical reference for your projects involving high-speed serial signaling on printed wiring boards.

Author: Stephen C. Thierauf
Publisher: Artech House
ISBN: 163081444X
Category : Technology & Engineering
Languages : en
Pages : 320

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Book Description
This thoroughly updated leading-edge circuit design resource offers the knowledge needed to quickly pinpoint transmission problems that can compromise the entire circuit design. This new edition demonstrates how to apply EM theory to solve signal integrity problems with a practical application-oriented approach. Discussing both design and debug issues at gigabit per second data rates, the book serves as a practical reference for projects involving high-speed serial signaling on printed wiring boards. Step-by-step, this book goes from reviewing the essentials of linear circuit theory, to examining practical issues of pulse propagation along lossless and lossy transmission lines. It provides detailed guidelines for crosstalk, attenuation, power supply decoupling, and layer stackup tradeoffs (including pad/antipad tradeoffs). Other key topics include the construction of etched conductors, analysis of return paths and split planes, microstrip and stripline characteristics, and SMT capacitors. Filled with on-the-job-proven examples, this hands-on reference is the book that engineers can turn to time and again to design out and troubleshoot circuit signal loss and impedance problems.

Author: Stephen H. Hall
Publisher: John Wiley & Sons
ISBN: 1118210689
Category : Science
Languages : en
Pages : 608

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Book Description
A synergistic approach to signal integrity for high-speed digital design This book is designed to provide contemporary readers with an understanding of the emerging high-speed signal integrity issues that are creating roadblocks in digital design. Written by the foremost experts on the subject, it leverages concepts and techniques from non-related fields such as applied physics and microwave engineering and applies them to high-speed digital design—creating the optimal combination between theory and practical applications. Following an introduction to the importance of signal integrity, chapter coverage includes: Electromagnetic fundamentals for signal integrity Transmission line fundamentals Crosstalk Non-ideal conductor models, including surface roughness and frequency-dependent inductance Frequency-dependent properties of dielectrics Differential signaling Mathematical requirements of physical channels S-parameters for digital engineers Non-ideal return paths and via resonance I/O circuits and models Equalization Modeling and budgeting of timing jitter and noise System analysis using response surface modeling Each chapter includes many figures and numerous examples to help readers relate the concepts to everyday design and concludes with problems for readers to test their understanding of the material. Advanced Signal Integrity for High-Speed Digital Designs is suitable as a textbook for graduate-level courses on signal integrity, for programs taught in industry for professional engineers, and as a reference for the high-speed digital designer.