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Author: Vishram Shriram Pandit Publisher: Pearson Education ISBN: 9780137011193 Category : Computer interfaces Languages : en Pages : 0
Book Description
Foreword by Joungho Kim The Hands-On Guide to Power Integrity in Advanced Applications, from Three Industry Experts In this book, three industry experts introduce state-of-the-art power integrity design techniques for today's most advanced digital systems, with real-life, system-level examples. They introduce a powerful approach to unifying power and signal integrity design that can identify signal impediments earlier, reducing cost and improving reliability. After introducing high-speed, single-ended and differential I/O interfaces, the authors describe on-chip, package, and PCB power distribution networks (PDNs) and signal networks, carefully reviewing their interactions. Next, they walk through end-to-end PDN and signal network design in frequency domain, addressing crucial parameters such as self and transfer impedance. They thoroughly address modeling and characterization of on-chip components of PDNs and signal networks, evaluation of power-to-signal coupling coefficients, analysis of Simultaneous Switching Output (SSO) noise, and many other topics. Coverage includes * The exponentially growing challenge of I/O power integrity in high-speed digital systems * PDN noise analysis and its timing impact for single-ended and differential interfaces * Concurrent design and co-simulation techniques for evaluating all power integrity effects on signal integrity * Time domain gauges for designing and optimizing components and systems * Power/signal integrity interaction mechanisms, including power noise coupling onto signal trace and noise amplification through signal resonance * Performance impact due to Inter Symbol Interference (ISI), crosstalk, and SSO noise, as well as their interactions * Validation techniques, including low impedance VNA measurements, power noise measurements, and characterization of power-to-signal coupling effects Power Integrity for I/O Interfaces will be an indispensable resource for everyone concerned with power integrity in cutting-edge digital designs, including system design and hardware engineers, signal and power integrity engineers, graduate students, and researchers.
Author: Vishram Shriram Pandit Publisher: Pearson Education ISBN: 9780137011193 Category : Computer interfaces Languages : en Pages : 0
Book Description
Foreword by Joungho Kim The Hands-On Guide to Power Integrity in Advanced Applications, from Three Industry Experts In this book, three industry experts introduce state-of-the-art power integrity design techniques for today's most advanced digital systems, with real-life, system-level examples. They introduce a powerful approach to unifying power and signal integrity design that can identify signal impediments earlier, reducing cost and improving reliability. After introducing high-speed, single-ended and differential I/O interfaces, the authors describe on-chip, package, and PCB power distribution networks (PDNs) and signal networks, carefully reviewing their interactions. Next, they walk through end-to-end PDN and signal network design in frequency domain, addressing crucial parameters such as self and transfer impedance. They thoroughly address modeling and characterization of on-chip components of PDNs and signal networks, evaluation of power-to-signal coupling coefficients, analysis of Simultaneous Switching Output (SSO) noise, and many other topics. Coverage includes * The exponentially growing challenge of I/O power integrity in high-speed digital systems * PDN noise analysis and its timing impact for single-ended and differential interfaces * Concurrent design and co-simulation techniques for evaluating all power integrity effects on signal integrity * Time domain gauges for designing and optimizing components and systems * Power/signal integrity interaction mechanisms, including power noise coupling onto signal trace and noise amplification through signal resonance * Performance impact due to Inter Symbol Interference (ISI), crosstalk, and SSO noise, as well as their interactions * Validation techniques, including low impedance VNA measurements, power noise measurements, and characterization of power-to-signal coupling effects Power Integrity for I/O Interfaces will be an indispensable resource for everyone concerned with power integrity in cutting-edge digital designs, including system design and hardware engineers, signal and power integrity engineers, graduate students, and researchers.
Author: Vishram S. Pandit Publisher: ISBN: Category : Languages : en Pages : 417
Book Description
Foreword by Joungho Kim The Hands-On Guide to Power Integrity in Advanced Applications, from Three Industry Experts In this book, three industry experts introduce state-of-the-art power integrity design techniques for today's most advanced digital systems, with real-life, system-level examples. They introduce a powerful approach to unifying power and signal integrity design that can identify signal impediments earlier, reducing cost and improving reliability. After introducing high-speed, single-ended and differential I/O interfaces, the authors describe on-chip, package, and PCB p.
Author: Vishram S. Pandit Publisher: ISBN: 9780132596947 Category : Computer interfaces Languages : en Pages : 0
Book Description
Foreword by Joungho Kim The Hands-On Guide to Power Integrity in Advanced Applications, from Three Industry Experts In this book, three industry experts introduce state-of-the-art power integrity design techniques for today's most advanced digital systems, with real-life, system-level examples. They introduce a powerful approach to unifying power and signal integrity design that can identify signal impediments earlier, reducing cost and improving reliability. After introducing high-speed, single-ended and differential I/O interfaces, the authors describe on-chip, package, and PCB power distribution networks (PDNs) and signal networks, carefully reviewing their interactions. Next, they walk through end-to-end PDN and signal network design in frequency domain, addressing crucial parameters such as self and transfer impedance. They thoroughly address modeling and characterization of on-chip components of PDNs and signal networks, evaluation of power-to-signal coupling coefficients, analysis of Simultaneous Switching Output (SSO) noise, and many other topics. Coverage includes • The exponentially growing challenge of I/O power integrity in high-speed digital systems • PDN noise analysis and its timing impact for single-ended and differential interfaces • Concurrent design and co-simulation techniques for evaluating all power integrity effects on signal integrity • Time domain gauges for designing and optimizing components and systems • Power/signal integrity interaction mechanisms, including power noise coupling onto signal trace and noise amplification through signal resonance • Performance impact due to Inter Symbol Interference (ISI), crosstalk, and SSO noise, as well as their interactions • Validation techniques, including low impedance VNA measurements, power noise measurements, and characterization of power-to-signal coupling effects Power Integrity for I/O Interfaces will be an indispensable resource for everyone concerned with power integrity in cutting-edge digital designs, including system design and hardware engineers, signal and power integrity engineers, graduate students, and researchers.
Author: Vishram S. Pandit Publisher: Pearson Education ISBN: 0132596962 Category : Technology & Engineering Languages : en Pages : 464
Book Description
Foreword by Joungho Kim The Hands-On Guide to Power Integrity in Advanced Applications, from Three Industry Experts In this book, three industry experts introduce state-of-the-art power integrity design techniques for today’s most advanced digital systems, with real-life, system-level examples. They introduce a powerful approach to unifying power and signal integrity design that can identify signal impediments earlier, reducing cost and improving reliability. After introducing high-speed, single-ended and differential I/O interfaces, the authors describe on-chip, package, and PCB power distribution networks (PDNs) and signal networks, carefully reviewing their interactions. Next, they walk through end-to-end PDN and signal network design in frequency domain, addressing crucial parameters such as self and transfer impedance. They thoroughly address modeling and characterization of on-chip components of PDNs and signal networks, evaluation of power-to-signal coupling coefficients, analysis of Simultaneous Switching Output (SSO) noise, and many other topics. Coverage includes The exponentially growing challenge of I/O power integrity in high-speed digital systems PDN noise analysis and its timing impact for single-ended and differential interfaces Concurrent design and co-simulation techniques for evaluating all power integrity effects on signal integrity Time domain gauges for designing and optimizing components and systems Power/signal integrity interaction mechanisms, including power noise coupling onto signal trace and noise amplification through signal resonance Performance impact due to Inter Symbol Interference (ISI), crosstalk, and SSO noise, as well as their interactions Validation techniques, including low impedance VNA measurements, power noise measurements, and characterization of power-to-signal coupling effects Power Integrity for I/O Interfaces will be an indispensable resource for everyone concerned with power integrity in cutting-edge digital designs, including system design and hardware engineers, signal and power integrity engineers, graduate students, and researchers.
Author: Greg Edlund Publisher: Pearson Education ISBN: 0132797186 Category : Technology & Engineering Languages : en Pages : 271
Book Description
Every day, companies call upon their signal integrity engineers to make difficult decisions about design constraints and timing margins. Can I move these wires closer together? How many holes can I drill in this net? How far apart can I place these chips? Each design is unique: there’s no single recipe that answers all the questions. Today’s designs require ever greater precision, but design guides for specific digital interfaces are by nature conservative. Now, for the first time, there’s a complete guide to timing analysis and simulation that will help you manage the tradeoffs between signal integrity, performance, and cost. Writing from the perspective of a practicing SI engineer and team lead, Greg Edlund of IBM presents deep knowledge and quantitative techniques for making better decisions about digital interface design. Edlund shares his insights into how and why digital interfaces fail, revealing how fundamental sources of pathological effects can combine to create fault conditions. You won’t just learn Edlund’s expert techniques for avoiding failures: you’ll learn how to develop the right approach for your own projects and environment. Coverage includes • Systematically ensure that interfaces will operate with positive timing margin over the product’s lifetime–without incurring excess cost • Understand essential chip-to-chip timing concepts in the context of signal integrity • Collect the right information upfront, so you can analyze new designs more effectively • Review the circuits that store information in CMOS state machines–and how they fail • Learn how to time common-clock, source synchronous, and high-speed serial transfers • Thoroughly understand how interconnect electrical characteristics affect timing: propagation delay, impedance profile, crosstalk, resonances, and frequency-dependent loss • Model 3D discontinuities using electromagnetic field solvers • Walk through four case studies: coupled differential vias, land grid array connector, DDR2 memory data transfer, and PCI Express channel • Appendices present a refresher on SPICE modeling and a high-level conceptual framework for electromagnetic field behavior Objective, realistic, and practical, this is the signal integrity resource engineers have been searching for. Preface xiii Acknowledgments xvi About the Author xix About the Cover xx Chapter 1: Engineering Reliable Digital Interfaces 1 Chapter 2: Chip-to-Chip Timing 13 Chapter 3: Inside IO Circuits 39 Chapter 4: Modeling 3D Discontinuities 73 Chapter 5: Practical 3D Examples 101 Chapter 6: DDR2 Case Study 133 Chapter 7: PCI Express Case Study 175 Appendix A: A Short CMOS and SPICE Primer 209 Appendix B: A Stroll Through 3D Fields 219 Endnotes 233 Index 235
Author: Geoff Lawday Publisher: Pearson Education ISBN: 0132797232 Category : Technology & Engineering Languages : en Pages : 650
Book Description
A Signal Integrity Engineer’s Companion Real-Time Test and Measurement and Design Simulation Geoff Lawday David Ireland Greg Edlund Foreword by Chris Edwards, Editor, IET Electronics Systems and Software magazine Prentice Hall Modern Semiconductor Design Series Prentice Hall Signal Integrity Library Use Real-World Test and Measurement Techniques to Systematically Eliminate Signal Integrity Problems This is the industry’s most comprehensive, authoritative, and practical guide to modern Signal Integrity (SI) test and measurement for high-speed digital designs. Three of the field’s leading experts guide you through systematically detecting, observing, analyzing, and rectifying both modern logic signal defects and embedded system malfunctions. The authors cover the entire life cycle of embedded system design from specification and simulation onward, illuminating key techniques and concepts with easy-to-understand illustrations. Writing for all electrical engineers, signal integrity engineers, and chip designers, the authors show how to use real-time test and measurement to address today’s increasingly difficult interoperability and compliance requirements. They also present detailed, start-to-finish case studies that walk you through commonly encountered design challenges, including ensuring that interfaces consistently operate with positive timing margins without incurring excessive cost; calculating total jitter budgets; and managing complex tradeoffs in high-speed serial interface design. Coverage includes Understanding the complex signal integrity issues that arise in today’s high-speed designs Learning how eye diagrams, automated compliance tests, and signal analysis measurements can help you identify and solve SI problems Reviewing the electrical characteristics of today’s most widely used CMOS IO circuits Performing signal path analyses based on intuitive Time-Domain Reflectometry (TDR) techniques Achieving more accurate real-time signal measurements and avoiding probe problems and artifacts Utilizing digital oscilloscopes and logic analyzers to make accurate measurements in high-frequency environments Simulating real-world signals that stress digital circuits and expose SI faults Accurately measuring jitter and other RF parameters in wireless applications About the Authors: Dr. Geoff Lawday is Tektronix Professor in Measurement at Buckinghamshire New University, England. He delivers courses in signal integrity engineering and high performance bus systems at the University Tektronix laboratory, and presents signal integrity seminars throughout Europe on behalf of Tektronix. David Ireland, European and Asian design and manufacturing marketing manager for Tektronix, has more than 30 years of experience in test and measurement. He writes regularly on signal integrity for leading technical journals. Greg Edlund, Senior Engineer, IBM Global Engineering Solutions division, has participated in development and testing for ten high-performance computing platforms. He authored Timing Analysis and Simulation for Signal Integrity Engineers (Prentice Hall).
Author: Joseph T. DiBene, II Publisher: John Wiley & Sons ISBN: 1118826345 Category : Technology & Engineering Languages : en Pages : 280
Book Description
An all-encompassing text that focuses on the fundamentals ofpower integrity Power integrity is the study of power distribution from thesource to the load and the system level issues that can occuracross it. For computer systems, these issues can range from insidethe silicon to across the board and may egress into other parts ofthe platform, including thermal, EMI, and mechanical. With a focus on computer systems and silicon level powerdelivery, this book sheds light on the fundamentals of powerintegrity, utilizing the author’s extensive background in thepower integrity industry and unique experience in silicon powerarchitecture, design, and development. Aimed at engineersinterested in learning the essential and advanced topics of thefield, this book offers important chapter coverage of fundamentalsin power distribution, power integrity analysis basics,system-level power integrity considerations, power conversion incomputer systems, chip-level power, and more. Fundamentals of Power Integrity for Computer Platforms andSystems: Introduces readers to both the field of power integrity and toplatform power conversion Provides a unique focus on computer systems and silicon levelpower delivery unavailable elsewhere Offers detailed analysis of common problems in theindustry Reviews electromagnetic field and circuit representation Includes a detailed bibliography of references at the end ofeach chapter Works out multiple example problems within each chapter Including additional appendixes of tables and formulas,Fundamentals of Power Integrity for Computer Platforms andSystems is an ideal introductory text for engineers of powerintegrity as well as those in the chip design industry,specifically physical design and packaging.
Author: Han-Ming Wu Publisher: The Electrochemical Society ISBN: 1566778069 Category : Science Languages : en Pages : 1203
Book Description
Our mission is to provide a forum for world experts to discuss technologies, address the growing needs associated with silicon technology, and exchange their discoveries and solutions for current issues of high interest. We encourage collaboration, open discussion, and critical reviews at this conference. Furthermore, we hope that this conference will also provide collaborative opportunities for those who are interested in the semiconductor industry in Asia, particularly in China.
Author: Bernd Hoefflinger Publisher: Springer Science & Business Media ISBN: 3642223990 Category : Science Languages : en Pages : 497
Book Description
The chips in present-day cell phones already contain billions of sub-100-nanometer transistors. By 2020, however, we will see systems-on-chips with trillions of 10-nanometer transistors. But this will be the end of the miniaturization, because yet smaller transistors, containing just a few control atoms, are subject to statistical fluctuations and thus no longer useful. We also need to worry about a potential energy crisis, because in less than five years from now, with current chip technology, the internet alone would consume the total global electrical power! This book presents a new, sustainable roadmap towards ultra-low-energy (femto-Joule), high-performance electronics. The focus is on the energy-efficiency of the various chip functions: sensing, processing, and communication, in a top-down spirit involving new architectures such as silicon brains, ultra-low-voltage circuits, energy harvesting, and 3D silicon technologies. Recognized world leaders from industry and from the research community share their views of this nanoelectronics future. They discuss, among other things, ubiquitous communication based on mobile companions, health and care supported by autonomous implants and by personal carebots, safe and efficient mobility assisted by co-pilots equipped with intelligent micro-electromechanical systems, and internet-based education for a billion people from kindergarden to retirement. This book should help and interest all those who will have to make decisions associated with future electronics: students, graduates, educators, and researchers, as well as managers, investors, and policy makers. Introduction: Towards Sustainable 2020 Nanoelectronics.- From Microelectronics to Nanoelectronics.- The Future of Eight Chip Technologies.- Analog–Digital Interfaces.- Interconnects and Transceivers.- Requirements and Markets for Nanoelectronics.- ITRS: The International Technology Roadmap for Semiconductors.- Nanolithography.- Power-Efficient Design Challenges.- Superprocessors and Supercomputers.- Towards Terabit Memories.- 3D Integration for Wireless Multimedia.- The Next-Generation Mobile User-Experience.- MEMS (Micro-Electro-Mechanical Systems) for Automotive and Consumer.- Vision Sensors and Cameras.- Digital Neural Networks for New Media.- Retinal Implants for Blind Patients.- Silicon Brains.- Energy Harvesting and Chip Autonomy.- The Energy Crisis.- The Extreme-Technology Industry.- Education and Research for the Age of Nanoelectronics.- 2020 World with Chips.
Author: Whitson G. Waldo Publisher: First Books ISBN: 1592994830 Category : Business & Economics Languages : en Pages : 314
Book Description
A Fully Integrated Presentation of New Hardware and Software Product Introductions Using Program Management Methodologies for System on Chip Platforms If you're an executive, manager, or engineer in the semiconductor, software, or systems industries, this book provides conceptual views ranging from the design of integrated circuits or systems on a chip, through fabrication, to integration of chips onto boards, and through development of enablement and runtime software for system and platform deliveries. Special features included this book are: - Program management methodologies - General management fundamentals - An overview of leadership principles - Basic discrete device technology - Internal structure and operation of some common logic gates - Basic integrated circuit design concepts, building blocks, and flow - Chip packaging technologies - Details of the fabrication process for integrated circuits - Printed circuit board design, manufacture, and test - Software design, development, and test - Integrated circuit test, silicon validation, and device qualification - Program management applications bringing it all together The book explores interactions and dependencies of technologies that impact systems and platforms. This is a valuable resource to learn these technologies or to use as a reference.
Author: Vishram Shriram Pandit
Author: Vishram Shriram Pandit
Author: Vishram S. Pandit
Author: Vishram S. Pandit
Author: Vishram S. Pandit
Author: Greg Edlund
Author: Geoff Lawday
Author: Joseph T. DiBene, II
Author: Han-Ming Wu
Author: Bernd Hoefflinger
Author: Whitson G. Waldo