Author: Cor L. ClaeysPublisher: The Electrochemical Society
ISBN: 9781566772419
Category : Computers
Languages : en
Pages : 408
Book Description
ULSI Process Integration
Author: Cor L. ClaeysPublisher: The Electrochemical Society
ISBN: 9781566772419
Category : Computers
Languages : en
Pages : 408
Book Description
ULSI Process Integration II
Author: Cor L. ClaeysPublisher: The Electrochemical Society
ISBN: 9781566773089
Category : Technology & Engineering
Languages : en
Pages : 636
Book Description
ULSI Process Integration 6
Author: C. ClaeysPublisher: The Electrochemical Society
ISBN: 1566777445
Category : Integrated circuits
Languages : en
Pages : 547
Book Description
ULSI Process Integration 6 covers all aspects of process integration. Sections are devoted to 1) Device Technologies, 2) Front-end-of-line integration (gate stacks, shallow junctions, dry etching, etc.), 3) Back-end-of-line integration (CMP, low-k, Cu interconnect, air-gaps, 3D packaging, etc.), 4) Alternative channel technologies (Ge, III-V, hybrid integration), and 5) Emerging technologies (CNT, graphene, polymer electronics, nanotubes).
ULSI Process Integration 5
Author: Cor L. ClaeysPublisher: The Electrochemical Society
ISBN: 1566775728
Category : Integrated circuits
Languages : en
Pages : 509
Book Description
The symposium provided a forum for reviewing and discussing all aspects of process integration, with special focus on nanoscaled technologies, 65 nm and beyond on DRAM, SRAM, flash memory, high density logic-low power, RF, mixed analog-digital, process integration yield, CMP chemistries, low-k processes, gate stacks, metal gates, rapid thermal processing, silicides, copper interconnects, carbon nanotubes, novel materials, high mobility substrates (SOI, sSi, SiGe, GeOI), strain engineering, and hybrid integration.
ULSI Process Integration III
Author: Electrochemical Society. MeetingPublisher: The Electrochemical Society
ISBN: 9781566773768
Category : Technology & Engineering
Languages : en
Pages : 620
Book Description
ULSI Process Integration 7
Author: C. ClaeysPublisher: The Electrochemical Society
ISBN: 1607682613
Category :
Languages : en
Pages : 429
Book Description
ULSI Process Integration 9
Author: C. ClaeysPublisher: The Electrochemical Society
ISBN: 1607686759
Category :
Languages : en
Pages : 335
Book Description
ULSI Semiconductor Technology Atlas
Author: Chih-Hang TungPublisher: John Wiley & Sons
ISBN: 9780471457725
Category : Technology & Engineering
Languages : en
Pages : 688
Book Description
More than 1,100 TEM images illustrate the science of ULSI The natural outgrowth of VLSI (Very Large Scale Integration), Ultra Large Scale Integration (ULSI) refers to semiconductor chips with more than 10 million devices per chip. Written by three renowned pioneers in their field, ULSI Semiconductor Technology Atlas uses examples and TEM (Transmission Electron Microscopy) micrographs to explain and illustrate ULSI process technologies and their associated problems. The first book available on the subject to be illustrated using TEM images, ULSI Semiconductor Technology Atlas is logically divided into four parts: * Part I includes basic introductions to the ULSI process, device construction analysis, and TEM sample preparation * Part II focuses on key ULSI modules--ion implantation and defects, dielectrics and isolation structures, silicides/salicides, and metallization * Part III examines integrated devices, including complete planar DRAM, stacked cell DRAM, and trench cell DRAM, as well as SRAM as examples for process integration and development * Part IV emphasizes special applications, including TEM in advanced failure analysis, TEM in advanced packaging development and UBM (Under Bump Metallization) studies, and high-resolution TEM in microelectronics This innovative guide also provides engineers and managers in the microelectronics industry, as well as graduate students, with: * More than 1,100 TEM images to illustrate the science of ULSI * A historical introduction to the technology as well as coverage of the evolution of basic ULSI process problems and issues * Discussion of TEM in other advanced microelectronics devices and materials, such as flash memories, SOI, SiGe devices, MEMS, and CD-ROMs
ULSI Process Integration 8
Author: Electrochemical SocietyPublisher:
ISBN: 9781623321000
Category :
Languages : en
Pages : 319
Book Description
Advanced Interconnects for ULSI Technology
Author: Mikhail BaklanovPublisher: John Wiley & Sons
ISBN: 1119966868
Category : Technology & Engineering
Languages : en
Pages : 616
Book Description
Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects, and discusses: Interconnect functions, characterisations, electrical properties and wiring requirements Low-k materials: fundamentals, advances and mechanical properties Conductive layers and barriers Integration and reliability including mechanical reliability, electromigration and electrical breakdown New approaches including 3D, optical, wireless interchip, and carbon-based interconnects Intended for postgraduate students and researchers, in academia and industry, this book provides a critical overview of the enabling technology at the heart of the future development of computer chips.